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IC distributor WT Micro expects over 10% revenue drop in 4Q24

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Backend firm ChipMOS cautious about about 2025 capital spending

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Mature process fab capacity stays oversupplied; VIS sees price war ease but pressure remains

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Intel CEO briefly visits Taiwan to finalize 3/2nm production capacity at TSMC

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Datang files lawsuit against Spreadtrum in China

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Elan bullish about notebook growth in 2025

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Chinese regulations strictly follow two premises, hindering lithium battery exports

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Tesla sales in China fall 23% in October

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AP Memory seeks to capitalize on robust HPC and AI chip demand

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Polarizer firms CMMT boosts high-value deployment

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Home Tech Semiconductors

Chipbond to merge with WSE to complete COG coverage

Esther Lam, DigiTimes.com, Taipei Wednesday 5 April 2006 0

Chipbond Technology announced on April 3 it will merge with WSE Corporation via a stock swap. Chipbond anticipates the merger will help the company complete its coverage of LCD driver IC testing and packaging production by strengthening its chip on...

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