VIA Technologies recently announced its VIA VX700 chipset for Ultra Mobile PC (UMPC) devices.
VIA said its VX700 solution, together with the C7-M/ULV processor, promises a smaller form factor for computing devices with reduced power consumption and enhanced functionality. The company said its UMPC solution could reduce mobile form factors size by up to 40% with low power and longer battery life.
VIA VX700 is expected to be available in volume quantities later in the third quarter of 2006 and pricing is available upon request, the company stated.
DualCor Technologies, which adopted the VIA solutions in its cPC, values the small size and enhanced battery life that VIA offers.
DualCor adopts VIA's solutions in its cPC
Source: DualCor
| Key features of VX700 chipset | |
| Item | Detail |
| Processor Support | VIA C7-M and VIA C7-M ULV processors |
| Front Side Bus (FSB) | 533/400MHz |
| Memory support | DDR2-533/400/333 or DDR-400/333 |
| Memory density (max.) | 4 GB |
| Graphics core | VIA UniChrome Pro |
| Hardware Video Acceleration | MPEG-2, MPEG-4, WMV9 HD |
| HDTV support | Yes |
| LVDS/DVI transmitter | Yes |
| Dual monitor support | Yes |
| Video de-blocking | Yes |
| Hardware display rotation | Yes |
| High definition audio | Yes |
| USB 2.0 connectivity | 6 ports |
| PCI devices/slots | 4 slots |
| Serial ATA |
2 x SATA 150 devices or 2 x SATA II devices |
| IDE | 1 EIDE channel up to 2 devices |
Source: VIA.
The VIA IGP VX700 chipset
Source: VIA
