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Winbond begins 80nm DRAM pilot run

Hans Wu, Taipei; Esther Lam, DIGITIMES Asia Monday 30 April 2007 0

In addition to reporting solid financial performance in the first quarter of 2007 at an investors conference on April 27, Winbond Electronics also announced its expansion on 12-inch wafer production, which includes the introduction of 80nm and preparation...

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