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Kinsus anticipates FC-CSP substrates to enhance blended ASP

Ingrid Lee, Taoyuan; Esther Lam, DIGITIMES Asia Thursday 31 May 2007 0

Kinsus Interconnect Technology anticipates that its average selling prices (ASPs) will be enhanced amid the production of flip chip chip-scale package (FC-CSP) substrates beginning from the second quarter of 2007, according to company general manager...

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