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HBM memory supply to scale in 2025

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Server component providers welcome new era with Nvidia GB200 mass production

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PCB and CCL firms gearing up for AI server boom

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First Dimensity 9400 AI mobile phone debut; Vivo expects X200 sales to treble

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Home Tech Semiconductors

UMC and TI collaborating on 45nm and 32nm processes

Claire Sung, Taipei; Rodney Chan, DIGITIMES Asia Monday 11 June 2007 0

United Microelectronics Corporation (UMC) chairman Jackson Hu has revealed that the foundry is working with Texas Instruments (TI) on 45nm and 32nm process technologies.

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SK Hynix starts mass production of world's first 321-high NAND

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