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STSP emerges as global chipmaking hub after almost 30 years of development

Luxshare to acquire nine Wingtech ODM subsidiaries

Buima steps up energy storage deployment to boost 2025 revenue

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Mainstream automakers increasingly prioritizing collaboration with Taiwan partners to compete with China

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ASE joins hands with Pegatron, substrate manufacturers for AI packaging substrate inspection

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IC design houses see unclear edge AI demand

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Taiwan technology R&D environment at risk of deteriorating

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AI remains main theme in semiconductors, with TSMC and Nvidia leading industry developments

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Home Tech Semiconductors

New issue of Chilisin CB leads to speculation of possible Yageo investment

Nuying Huang, Taipei; Esther Lam, DIGITIMES Asia Tuesday 17 July 2007 0

Following Chilisin Electronics' recently announced issue of a company bond (CB), industry watchers suspect that Yageo may further increase its stake at the company.

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