TSMC affiliate completes equipment installation at 12-inch WL-CSP fab

Ingrid Lee, Taipei; Rodney Chan, DIGITIMES Asia Tuesday 6 November 2007 0

Image sensor packaging house Xintec, an affiliate of Taiwan Semiconductor Manufacturing Company (TSMC), has revealed that its has completed equipment installation at its first 12-inch wafer-level chip size packaging (WL-CSP) fab at the Hsinchu Science...

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