STMicroelectronics lays first stone for backend plant in China

Press release, November 5; Esther Lam, DIGITIMES Asia Tuesday 6 November 2007 0

STMicroelectronics laid the first stone at the site of its future chip packaging and test facility in Longgang, Guangdong Province, China, on November 5. This plant will be among STMicroelectronics' largest packaging and test facilities worldwide when...

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