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STATS ChipPAC announces volume manufacturing of fcCuBE technology

Press release; Jessie Shen, DIGITIMES Asia Monday 9 July 2012 0

STATS ChipPAC has announced its fcCuBE technology - an advanced flip chip packaging technology that features copper (Cu) column bumps, bond-on-lead (BOL) interconnection and enhanced assembly processes - is in high volume production for multiple customers,...

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