Indium Corporation was presented with the Global Technology Award for Best Products - Americas for InFORMS high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.
InFORMS are revolutionary in their ability to provide uniform bondline thickness. An uneven solder bondline thickness can cause stress at the thinner sections, leading to delamination and premature failure during the operational life of the module. The uniform bondline thickness created by InFORMS prevents this stress.
InFORMS also ensure high reliability by reducing voiding.
In testing, InFORMS have shown to improve the reliability of the interconnect to at least 3,500 thermal cycles, which drastically exceeds the typical reliability specification of 1,500 passive thermal cycles for -55/+150 degrees C.
Sponsored by Global SMT & Packaging, the Global Technology Awards have acknowledged outstanding innovations in the printed circuit board assembly and packaging industry for the past 10 years.
For information about InFORMS, visit www.indium.com/informs or email askus@indium.com.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit http://www.indium.com/ or email abrown@indium.com. You can also follow our experts, From One Engineer To Another (#FOETA), at www.facebook.com/indium or @IndiumCorp.
InFORMS
