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Intel looks to add Wi-Fi and USB 3.1 support into next-generation chipsets
Monica Chen and Cage Chao, Taipei; Joseph Tsai, DIGITIMES
Intel reportedly is planning to add USB 3.1 and Wi-Fi functions into its motherboard chipsets and the new design may be implemented in its upcoming 300-series scheduled to be released at the end of 2017, according to sources from motherboard makers...
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The coronavirus outbreak has disrupted production and weakened consumer confidence, with all ICT sectors bracing for major declines in shipments. Digitimes Research has conducted analyses on three mobile device sectors, namely notebooks, smartphones and tablets in the wake of the outbreak.