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Breakthrough in MCCE process to enhance competitiveness of DW-sliced poly-Si wafers

Nuying Huang, Taipei; Adam Hwang, DIGITIMES Friday 1 December 2017 0

A breakthrough in MCCE (metal-catalyzed chemical etching) technology used in the production of diamond wire (DW)-sliced poly-Si wafers has enhanced significantly the competitiveness of such wafers against mono-Si wafers, according to industry sources...

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