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Winbond on track to open new memory fab by 2021

Jessie Shen, DIGITIMES, Taipei Tuesday 23 July 2019 0

Specialty DRAM and flash memory chipmaker Winbond Electronics on July 22 held a beam-raising ceremony for its new 12-inch wafer plant in Kaohsiung, southern Taiwan. The new facility is on track to have Winbond's in-house developed 20nm process technology...

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