COF packaging demand for OLED DDI chips to grow sharply in 2020

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Tuesday 3 September 2019 0

COF substrate makers and related packaging houses are expected to operate at full capacity through the end of 2019 on robust demand from smartphone vendors, and their revenues may be further driven by explosive demand for OLED DDI (display driver IC)...

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