Bits + chips
SiP, AiP processes to gain momentum for 5G applications in 2020
Julian Ho, Taipei; Willis Ke, DIGITIMES

System-in-package (SiP) will gain significant growth momentum in 2020 as it will be badly needed to process wireless connectivity devices including RF front-end modules, antenna modules and power amplifiers for 5G applications. And ASE Technology Holding...

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