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ASE obtains FC packaging orders for new Qualcomm 5G SoC

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Thursday 3 December 2020 0

ASE Technology has reportedly grabbed flip-chip packaging orders for Qualcomm's just-unveiled flagship 5G SoC Snapdragon 888, as well as orders for the new integrated X60 5G modem, according to industry sources.

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