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China OSATs strengthen QFN packaging capability for car chips

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Tuesday 24 August 2021 0

China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive ICs, according to industry sources.

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