中文網
Taipei
Mon, Oct 18, 2021
16:15
mostly cloudy
25°C
CONNECT WITH US
Chipmakers working with partners to step up deployments in 5G RF devices
Julian Ho, Taipei; Jessie Shen, DIGITIMES 0

Credit: DIGITIMES

Fabless chipmakers are looking to step up their deployments in the 5G RF front-end module (RF FEM) and other device markets by working closely with their manufacturing partners, according to industry sources.

The premium content you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories