the TPCA Show and IMPACT Conference 2023 was held in Taiwan at the Taipei Nangang Exhibition Center Hall 1 from October 25th to 27th. The strategic brand presence of MKS, Atotech and ESI impressed visitors at the show. The crowded booth, the many paper presentations at the IMPACT conference and the specially hosted session on "AI advanced packaging" draw special attention to the company this year, a leader in Taiwan's PCB, IC Substrate and Semiconductor industries.
MKS' teams on the show floor
The teams from both strategic MKS brands came together to represent the new combined company and its combined expertise in advanced PCB via drilling systems, lasers, optics and motion with process chemistry and equipment for current process and yield optimization, as well as next generation product development, e.g. for advanced material processing, via formation, glass package substrates, solar, batteries and more. One of the focal points at the show was on Optimize the Interconnect which can be achieved with Atotech and ESI products and services. Optimize the Interconnect is an MKS offering that provides printed circuit board (PCB) and advanced electronics packaging customers with a wide range of products and services for creating interconnects in the most advanced PCB and IC packaging designs. Services include PCB and advanced electronics packaging interconnect creation and evaluation services, access to the MKS Technology Centers for installation, setup and troubleshooting services, application development services, application labs and support, design and development services, and maintenance, repair and calibration services.
This unique combination of MKS' via drilling and routing, and chemical plating expertise enables customers to accelerate their product roadmaps, solve the challenges associated with new materials and finer feature sizes, and thereby creating the interconnection more effectively with higher quality output and faster time to market.
MKS' Management interviewed by Gary
MKS' team with TPCA Mr. Bai
We offer a broad range of MKS' technologies and capabilities?Xsuch as lasers, precision optics, motion control, beam measurement, via drilling systems and process chemistry?Xto provide a unique solution for optimizing the manufacturing of PCB and advanced electronics packaging interconnects, a key part of the overall PCB and advanced electronics packaging manufacturing process.
"We understand the importance of providing our customers with the best solutions and services including sustainable products and energy-saving equipment to create win-win situations for our customers," said Daniel Schmidt, Global Marketing Director. Throughout the week, various local and international executives were available to meet with teams, customers, partners, and prospects to discuss the way forward with a special focus on the latest industry trends and challenges. The teams made special efforts to welcome and introduce the latest technologies and solutions to key industry participants and customers and the team demonstrated our new synergies and total solution package consisting of PCB production equipment (wet-to-wet process equipment, laser systems, and auxiliaries), chemistry, software, and service to the Taiwanese PCB industry. After one year since the acquisition, the industry and especially our customers are expressing high confidence in our integration, and trust that we can provide them with more complete solutions to support their future product and manufacturing development roadmap.
MKS' Industrial Forum and the audiences
Presenters of the MKS' Industrial Forum
The team also presented 8 papers at the IMPACT technical conference this year. A key event was the IMPACT industrial forum on October 25 from 1:30?V 3:30pm, where industry leaders in their respective fields were invited to speak about their contribution to the developments in AI to create a new era of advanced packaging. Daniel Schmidt, Global Marketing Director said: "The special industrial session helped our company to draw attention to industry trends, challenges, and possible solutions. Many questions were asked and discussed during the session, and it showed our contributions not only in our solutions, but also in the technology developments within our industries."
