Samsung and SK Hynix set to introduce new HBM wafer debonding technology

Daniel Chiang, Taipei; Jack Wu, DIGITIMES Asia Wednesday 10 July 2024 0

Credit: Samsung

Samsung Electronics and SK Hynix are investing in R&D of new process technologies to prevent warpage in next-generation high-bandwidth memory (HBM). This move is anticipated to bring about changes in the materials and equipment supply chains.

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