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Mobile phone PCB contract prices down 12-13%

Compiled from outside sources by Vincent Huang, Research Center; Noah Sauve, DIGITIMES Asia 0

According to the Nikkei Sangyo Shimbun, the average contract price for high-density, multi-layer mobile phone PCBs (printed circuit boards) is expected to drop 12-13% in 2001 – much greater than the 8-9% drop in past years.

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