Home Tech Semiconductors

Intel, Samsung and TSMC reach agreement for 450mm wafer manufacturing transition

Press release, May 6; Esther Lam, DIGITIMES Asia Tuesday 6 May 2008 0

Intel, Samsung Electronics and Taiwan Semiconductor Manufacturing Company (TSMC) announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012. The transition...

The article requires paid subscription. Subscribe Now

Email address

Password

Save my User ID and Password

Save my User ID and Password

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

NEW individual users please REGISTER first.

Enterprise user first-time LOGIN.

I forgot my ID and/or password?

MEMBERSHIP BENEFITS