CONNECT WITH US
Tuesday 9 July 2024
Largan navigates AI challenges, diversifies portfolio amid shifting smartphone lens market
Largan Precision, a leading smartphone lens manufacturer, is facing challenges due to the increasing influence of AI in the smartphone market and its impact on talent recruitment in the semiconductor industry
Monday 8 July 2024
Innolux's transformation journey: from display panel to advanced semiconductor packaging
Innolux Corporation, a leading display panel manufacturer, is undergoing a significant transformation as it ventures into the semiconductor field with its Fan-Out Panel Level Packaging (FOPLP) technology. The company is closing its generation 5.5 TFT-LCD plant and has garnered attention due to its collaboration with TSMC on FOPLP development and potential interest from Micron Technology in acquiring the aforementioned plant
Monday 24 June 2024
Intel Foundry's 3nm process is catching up fast, should Samsung worry about it?
Samsung and Intel are trying to overtake TSMC, but TSMC chairman C. C. Wei's answer to that challenge is: "No way!"
Friday 21 June 2024
RISC-V's rapid growth and hurdles ahead: US-China tech tensions and ecosystem fragmentation
RISC-V, an open standard instruction set architecture, has garnered global attention due to its royalty-free nature and adaptability for custom hardware development
Tuesday 18 June 2024
Nvidia and AMD are winners of the 4 million units per year high-end GPU chip business
Nvidia dominates the market for AI chips for training and deploying Large Language Models (LLMs) and its pricing power is reflected in gross margins as high as 78%, compared to competitors Intel and AMD's 41% and 47% gross margins, respectively, in the latest quarter. So how many high-end GPU chips did Nvidia sell
Monday 17 June 2024
HBM competition (3): the likely changes in the industry ecosystem
Before we discuss the possible impact of HBM4 standard interface on the DRAM industry, we need to review the current status of the DRAM industry
Monday 17 June 2024
Partnership with Google TPU is logical choice for Apple to fuel computing power demand of Apple Intelligence
According to a recent Reuters report, Apple's "Apple Intelligence" technology has been rumored to use Google's Tensor Processing Unit (TPU) accelerators for early-stage training, illustrating the close cooperation between Apple and Google in the AI sector. Apple may even be using Google Cloud services
Thursday 13 June 2024
Apple doesn't want OpenAI partnership to overshadow Apple Intelligence
At WWDC 2024, Apple announced "Apple Intelligence," adding its own branding to the terminology of artificial intelligence (AI)
Thursday 13 June 2024
HBM competition (2): The choice of HBM's next steps?
It is important to know how individual memory companies choose to develop their High Bandwidth Memory (HBM) technology for future competitions
Friday 7 June 2024
China Resources' acquisition of JCET shares is killing two birds with one stone
In March, China Resources announced the stunning news of acquiring SMIC's shares of JCET Group, a packaging and testing firm invested by China's National IC Industry Investment Fund (the "Big Fund"). The deal is a delicately calculated move rendering China Resources control over JCET and Sandisk
Thursday 6 June 2024
Intel's Lunar Lake rescued by TSMC 3nm process?
Intel CEO Pat Gelsinger's keynote at COMPUTEX 2024, specifically mentioned the collaboration with TSMC, which allowed Intel to realize the mass production of Lunar Lake in advancing AI PCs. This move raises questions about whether it is an attempt to repair the relationship with TSMC
Thursday 6 June 2024
How hard to snatch 2nm foundry orders from TSMC?
Semiconductor foundry companies have started to compete in the 2nm process shortly after their 3nm production lines started humming to mass produce for customers. There is something to learn from Samsung's 6-month lead to producing 3nm wafers with Gate-All-Around (GAA) architecture in June 2022
Wednesday 5 June 2024
For Big Fund Phase 3, the devil is in the funding structure details
The long-rumored third phase of China's national semiconductor fund, commonly known as "the Big Fund," has finally been officially announced. The fund scale of CNY344 billion (US$47.5 billion) makes it the largest funding project in China's chip history and far exceeds previous market expectations
Wednesday 5 June 2024
How Taiwan is related to Nvidia's rise to stardom in the AI Era
Nvidia, founded in 1993, has established itself as a leading player in the Graphics Processing Unit (GPU) market
Monday 3 June 2024
Why China needs US$47.5 billion for Big Fund Phase 3 when chip oversupply is already a concern?
Announcing a US$47.5 billion funding for Phase 3 of the National IC Industry Investment Fund (the "Big Fund"), China's next move is under the eye of global chip players
Colder Products Company
AIoT
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research