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Thursday 13 June 2024
HBM competition (2): The choice of HBM's next steps?
It is important to know how individual memory companies choose to develop their High Bandwidth Memory (HBM) technology for future competitions
Friday 7 June 2024
China Resources' acquisition of JCET shares is killing two birds with one stone
In March, China Resources announced the stunning news of acquiring SMIC's shares of JCET Group, a packaging and testing firm invested by China's National IC Industry Investment Fund (the "Big Fund"). The deal is a delicately calculated move rendering China Resources control over JCET and Sandisk
Thursday 6 June 2024
Intel's Lunar Lake rescued by TSMC 3nm process?
Intel CEO Pat Gelsinger's keynote at COMPUTEX 2024, specifically mentioned the collaboration with TSMC, which allowed Intel to realize the mass production of Lunar Lake in advancing AI PCs. This move raises questions about whether it is an attempt to repair the relationship with TSMC
Thursday 6 June 2024
How hard to snatch 2nm foundry orders from TSMC?
Semiconductor foundry companies have started to compete in the 2nm process shortly after their 3nm production lines started humming to mass produce for customers. There is something to learn from Samsung's 6-month lead to producing 3nm wafers with Gate-All-Around (GAA) architecture in June 2022
Wednesday 5 June 2024
For Big Fund Phase 3, the devil is in the funding structure details
The long-rumored third phase of China's national semiconductor fund, commonly known as "the Big Fund," has finally been officially announced. The fund scale of CNY344 billion (US$47.5 billion) makes it the largest funding project in China's chip history and far exceeds previous market expectations
Wednesday 5 June 2024
How Taiwan is related to Nvidia's rise to stardom in the AI Era
Nvidia, founded in 1993, has established itself as a leading player in the Graphics Processing Unit (GPU) market
Monday 3 June 2024
Why China needs US$47.5 billion for Big Fund Phase 3 when chip oversupply is already a concern?
Announcing a US$47.5 billion funding for Phase 3 of the National IC Industry Investment Fund (the "Big Fund"), China's next move is under the eye of global chip players
Thursday 30 May 2024
HBM competition (1): advanced packaging technology divergence explained
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU in Artificial Intelligence (AI) computing
Wednesday 29 May 2024
Semiconductor industry co-opetition between Taiwan and South Korea
The semiconductor industry is the lifeblood of South Korea, a country that heavily depends on its exports. In 2023, South Korea exported US$131 billion of semiconductors and imported US$106 billion, raking in US$25 billion in trade surplus. For Taiwan, when there is a trade deficit, it only amounts to a fraction of its foreign reserve, but that would be a heavy burden to South Korea, which is already shouldering US$663.6 billion in foreign debt
Tuesday 28 May 2024
China can break through US EUV ban with mature-node innovation, but how?
China's Huawei claims to have successfully achieved domestic substitution of using its self-developed 7nm and 5nm chips in its smartphones and has boosted market standings of HiSilicon and SMIC
Monday 27 May 2024
Innovation vs. regulation: Taiwan struggles to balance AI legislation amid global scrutiny
As global AI regulations gain momentum, Taiwan—a key player in AI hardware—has yet to finalize its "Artificial Intelligence Basic Act.
Monday 27 May 2024
Will Chinese EV makers leverage declining sales to limit losses?
The cutthroat price competition in China in the past year has pressured many local automakers, resulting in significant losses. Some companies might have accepted their falling EV sales and withdrawn from the price war, a strategy to improve their losses
Monday 27 May 2024
Executive shake-ups at OpenAI and Amazon highlight shared challenges in balancing agility and stability
In recent days, both OpenAI and Amazon have seen significant changes in their senior leadership teams. While the reshuffling may seem coincidental, it highlights the similar challenges both companies face in balancing agility with maintaining a controversy-free image
Friday 24 May 2024
AI becomes the key to new paradigm shifts and how TSMC responds to new era
Since the turn of the century in the year 2000, the changes brought to the world by digital technology and the Internet can be roughly categorized into four phases. The first phase was the post-dot-com bubble era in the early 2000s, and the leading vendors of this era were Nokia and Cisco, which provided networking equipment
Thursday 23 May 2024
Generative AI not a bubble, market scale to hit US$1.5 trillion by 2030
Generative AI (GenAI) is a subset within the AI realm, and it is expected to be one of the most critical driving forces for global economic growth in the next 5-10 years
CPC
Summary of Tech Supply Chain News!
AIoT
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research
Competitive color technologies expand e-paper market potential, moving beyond zero-sum game, says DIGITIMES Research
Global smartphone shipments from Chinese brands to rise in 3Q24 and 4Q24, says DIGITIMES Research