Nvidia CEO Jensen Huang addressed the company's partnerships with Arm, High-Bandwidth Memory (HBM) manufacturers, Cloud Service Providers (CSP), and Taiwan's high-tech supply chains, which are led by TSMC, during a press Q&A session at Computex 2024 in Taipei. He also shared his vision for AI and commented on the competition. The following is a summary of the Q&A session
In March, China Resources announced the stunning news of acquiring SMIC's shares of JCET Group, a packaging and testing firm invested by China's National IC Industry Investment Fund (the "Big Fund"). The deal is a delicately calculated move rendering China Resources control over JCET and Sandisk
PC industry players are eagerly anticipating the arrival of AI PCs to drive a new wave replacement cycle, with Microsoft defining specifications for AI PCs under the Copilot+ PC label that includes the integration of NPUs and chip capabilities reaching 40+ TOPS
Intel CEO Pat Gelsinger's keynote at COMPUTEX 2024, specifically mentioned the collaboration with TSMC, which allowed Intel to realize the mass production of Lunar Lake in advancing AI PCs. This move raises questions about whether it is an attempt to repair the relationship with TSMC
Semiconductor foundry companies have started to compete in the 2nm process shortly after their 3nm production lines started humming to mass produce for customers. There is something to learn from Samsung's 6-month lead to producing 3nm wafers with Gate-All-Around (GAA) architecture in June 2022
The long-rumored third phase of China's national semiconductor fund, commonly known as "the Big Fund," has finally been officially announced. The fund scale of CNY344 billion (US$47.5 billion) makes it the largest funding project in China's chip history and far exceeds previous market expectations
OwlTing, originally a Taiwanese startup using blockchain technologies for farm product resumes and hotelier payment systems, has made remarkable strides in transformation and acquisition and will start providing more cost-effective and faster cross-border financial services to Information Communications Technology (ICT) supply chains transitioning to the Americas
Announcing a US$47.5 billion funding for Phase 3 of the National IC Industry Investment Fund (the "Big Fund"), China's next move is under the eye of global chip players
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU in Artificial Intelligence (AI) computing
The semiconductor industry is the lifeblood of South Korea, a country that heavily depends on its exports. In 2023, South Korea exported US$131 billion of semiconductors and imported US$106 billion, raking in US$25 billion in trade surplus. For Taiwan, when there is a trade deficit, it only amounts to a fraction of its foreign reserve, but that would be a heavy burden to South Korea, which is already shouldering US$663.6 billion in foreign debt
Micron Technology's High-Bandwidth Memory (HBM) sales will climb to several hundred million US dollars in the current fiscal year and then to several billion US dollars in the next fiscal year, which begins in September 2024, according to company EVP and chief business officer Sumit Sadana
China's Huawei claims to have successfully achieved domestic substitution of using its self-developed 7nm and 5nm chips in its smartphones and has boosted market standings of HiSilicon and SMIC
