On February 28, Hangzhou convened an AI development summit at the Hangzhou Civic Center aimed at positioning the city as China's leading artificial intelligence (AI) hub. According to East Money and Xinhua, 12 AI projects were signed, with a total investment of CNY25.5 billion (US$3.71 billion)

China's embodied AI and humanoid robotics sector is drawing fresh investment, with two major financing deals signaling accelerating commercialization

Huawei on March 4 unveiled what it said is the world's first mass-produced 896-channel automotive LiDAR, a sensor designed to significantly increase perception resolution for advanced driver-assistance and autonomous driving systems

ASUS IoT is redefining the urban landscape by positioning itself as the high-performance backbone for modern smart cities, using edge AI and machine learning to transform infrastructure into proactive, life-saving networks. At Automation World (AW) 2026, ASUS said that by deploying edge computers and intelligent sensors, it facilitates real-time traffic management, automated emergency response, and energy-efficient smart poles. This is all while navigating the complex regulatory and privacy landscapes of global markets. ASUS's approach targets 40% reductions in crime, 20% shorter commutes, and 15% lower greenhouse-gas (GHG) emissions. It is clear the company is preparing for a counterstereotypical future of smart cities, where "intelligence" may even adopt new meanings

On March 4 local time, the White House will host a signing ceremony that could influence the direction of global AI competition. Technology and AI leaders, including Amazon, Meta, Microsoft, Google, xAI, Oracle, and OpenAI, are scheduled to gather in Washington to sign the Ratepayer Protection Pledge

Lens Technology said SSDs assembled for enterprise NVMe storage supplier DERA have entered mass shipment at its facility in the Xiangtan Economic and Technological Development Zone, marking the company's expansion into the high-end data center storage supply chain

Demand from Nvidia and Apple has intensified shortages of high-end glass fiber cloth used in IC substrates, driving broad price increases for related materials and squeezing profit margins for copper clad laminate (CCL) suppliers. Japanese materials makers have recently taken the lead in raising prices, shifting rising costs downstream to customers and end markets