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Monday 3 June 2024
Changes in Samsung's smartphone camera module supply chain in 2024 saw Partron rise to no.2
Entering 2024, there have been changes in Samsung Electronics' smartphone camera module supply chain. Semco maintains its spot as the sales leader while Partron has risen to second place. Notably, Mcnex, which dropped to sixth place in 2023, has climbed back up to third. Power Logics, which was second in 2023, has fallen to fourth
Monday 3 June 2024
Huawei's Ascend AI GPU series gaining traction, Nvidia facing uphill battle in China market
While Nvidia CEO Jensen Huang is visiting supply chain partners in Taiwan to secure production capacity for its high-end AI GPUs, the company is plagued by limitations on its China-specific H20 AI GPU technology. It is unusually lowering sales prices in the Chinese market to counter increasing rivalry from Chinese players, particularly Huawei, which is reportedly set to launch a new comparable 5nm AI GPU in 2025
Monday 3 June 2024
Weekly news roundup: Russia to begin production of 350nm chips using self-developed EUV lithography machines in 2024
These are the most-read DIGITIMES Asia stories in the week of May 27 – May 31
Monday 3 June 2024
LG Innotek aims to start solid-state LiDAR volume production in 2H24
LG Innotek and Hyundai Mobis have jointly applied for patents for LiDARs used in self-driving cars as LG Group and Hyundai Motor Group expand their collaboration on automotive electronics. LG Innotek plans to begin mass production of solid-state LiDARs in the second half of 2024
Monday 3 June 2024
Samsung Foundry hopes to turn things around with 3nm; AMD's Lisa Su hints at possible partnership
The competition for advanced process orders between Samsung Electronics and TSMC has long been a point of attention in the industry
Friday 31 May 2024
South Korea's chip stockpiles shrink at fastest pace in 10 years
South Korea's semiconductor inventories dwindled by the most since 2014, underscoring the pace at which demand is outstripping supply as customers rev up their purchases of devices needed to develop artificial intelligence technologies
Friday 31 May 2024
Tesla reportedly to register FSD software in China
Tesla is said to proceed with a plan to launch its Full Self-Driving (FSD) software in China. The EV company is on track to register the technology and aims to activate the service later this year
Friday 31 May 2024
Japan considering ways to provide additional financial resources to Rapidus
As previous subsidies of a total of JPY920 billion (nearly US$6 billion) may not be sufficient to help Rapidus achieve its goal of mass-producing 2nm chips, Japan's Ministry of Economy, Trade and Industry (METI) plans to propose legislation to provide loan guarantees for the chipmaker
Friday 31 May 2024
Mitsubishi Electric, Aisin form automotive parts company to counter China's low-cost attack
Mitsubishi Electric, its subsidiary Mitsubishi Electric Mobility, and automotive components supplier Aisin recently announced they will establish a joint venture to make next-generation car parts. The move, which will accelerate R&D speed, is a response to the cost reduction trend driven by China's low-cost EVs.
Friday 31 May 2024
Chinese CIS suppliers expand presence in high-end smartphone market
The Chinese semiconductor industry, including the CMOS Image Sensor (CIS) segment, is finding more room for development in the domestic market with the sudden rise of the Chinese smartphone and Electric Vehicle (EV) industries
Thursday 30 May 2024
Samsung's new chip chief seeks to rally troops after setbacks
The new head of Samsung Electronics Co.'s semiconductor division urged employees to work their way past challenges in the business, making his first remarks to staff after the surprise departure of his predecessor last week
Thursday 30 May 2024
Samsung boosts workforce at Japan R&D lab to drive chips packaging innovations
Samsung Electronics has recently expanded its workforce deployment at its new packaging R&D base in Yokohama, Japan, to expedite construction and support the development of next-generation semiconductor packaging technologies
Thursday 30 May 2024
Sony adjusts CIS production expansion schedule; equipment investment reduced for next three years
Sony's semiconductor business division, primarily focused on CMOS Image Sensors (CIS), plans to reduce its equipment investment amount in the next three fiscal years from 2024 to 2026 (April 2024 to March 2027) by about 30% compared to the previous three-year mid-term plan
Thursday 30 May 2024
Automotive LED supplier Brightek sees rebounding orders from Chinese NEV market
As China's automotive market plunges into intense internal price competition, Brightek Optoelectronic Co. focuses on automotive LED products as the main driver of its operational growth
Thursday 30 May 2024
Following in BOE's footsteps, Visionox announces 8.6-gen OLED investment
China's panel industry is accelerating its venture into the IT OLED market
CPC
Summary of Tech Supply Chain News!
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research