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Tuesday 9 July 2024
Samsung to make 2nm chips for Japan AI firm
Samsung Electronics has announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube S (I-Cube S) to Preferred Networks, a leading Japanese AI company
Tuesday 9 July 2024
Japan invests in AI translation to boost ACGN export
The Japanese government's intellectual property export strategy, known as the "Cool Japan" strategy, proposed its latest amendment in 2024. It identified translation as the primary obstacle in developing overseas markets for Japan's ACGN (Anime, Comic, Game, Light Novel) industry. To address this challenge, industry players are actively investing in AI translation technology, sparking controversy within the translation industry
Tuesday 9 July 2024
EU tariff on Chinese EVs stirs industry waters, MG holds steady
The European Union's temporary tariff on Chinese electric vehicles (EVs) kicked in on the 5th, sparking varied reactions among automakers. Despite initial assurances from Chinese manufacturers that their European operations would remain unaffected and prices stable, there are signs of a shift in their stance
Tuesday 9 July 2024
Computing clusters with at least 10,000 GPUs become basic requirement for Chinese Gen-AI LLMs

The keen competition of large-language models (LLMs) is pushing various Generative AI operators in China to find alternatives to achieve higher computing power without Nvidia's advanced GPU cards such as A100

Tuesday 9 July 2024
SoftBank to acquire British AI chip designer Graphcore for US $500 million
SoftBank offered to acquire Graphcore, which designs AI chips for data centers, for US$500 million. The deal is subject to review by the UK, while SoftBank's massive stake in Arm likely smooths the way for the acquisition
Tuesday 9 July 2024
Nvidia's H20 to go head-to-head with Chinese AI chips; procurement intent from major CSPs will be key
The rapid development of large language models (LLMs) in China has led to various development bottlenecks for AI, including complex computing power management, high training and inference costs for LLMs, and task scheduling difficulties
Tuesday 9 July 2024
Samsung develops FOWLP-HPB packaging solution to curb mobile AP overheating
Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation Exynos processors by the end of 2024
Tuesday 9 July 2024
Wafer Works ramps up cross-strait 12-inch production, eyes strong second half
Wafer Works, a veteran semiconductor silicon wafer foundry in China, made its debut on Shanghai's STAR Market in February 2024. Simultaneously, the company launched a major expansion project for 12-inch wafer production across facilities in Taiwan's Erlin and China's Zhengzhou, with completion expected by late 2025. Each site aims for a monthly capacity of 200,000 wafers, and construction is already underway
Tuesday 9 July 2024
Chinese EVs accelerate global expansion despite trade barriers
China's electric vehicle (EV) industry is aggressively pushing into overseas markets, navigating trade barriers from Europe and the US designed to stall its progress. However, these obstacles are only temporarily hindering China's EV exports while accelerating the relocation of its global supply chain
Tuesday 9 July 2024
OmniVision expands automotive CIS market share
Onsemi and OmniVision are now in a tight race for leadership in the automotive CMOS image sensor (CIS) market, with conflicting reports from research firms about which company held the top position in 2023
Monday 8 July 2024
AI advances propel bipedal robots: Japan lags as US and China lead breakthroughs
While Japanese manufacturers have long been at the forefront of bipedal humanoid robot development, recent AI breakthroughs from the US and China's IT industry have propelled these innovations forward. Rows of bipedal robots showcased by tech companies at AI industry events have captivated global attention
Monday 8 July 2024
Samsung establishes HBM development team as first major change under new DS division head
Under the guidance of newly appointed head Young Hyun-Jun, Samsung Electronics' Semiconductor and Device Solutions (DS) division is reportedly enhancing its competitiveness in high-bandwidth memory (HBM) and advanced packaging (AVP) through strategic organizational restructuring and reforms. According to ZDNet Korea, the DS division's recent reorganization primarily focuses on HBM, AVP, and the Equipment Technology Research Institute
Monday 8 July 2024
Taiwanese PA chip makers see strong demand from China and US
As the smartphone industry enters its peak shipment season in the second half of 2024, major brands are launching new devices. Taiwan's power amplifier (PA) chip supply chains, including Win Foundry, AWSC, and VPEC, are experiencing impressive sales results
Monday 8 July 2024
TSMC subsidiary JASM to double hiring for new chip factories in Japan
Japan Advanced Semiconductor Manufacturing (JASM), a subsidiary of Taiwan Semiconductor Manufacturing Company (TSMC), is set to significantly increase its workforce in spring 2025. The company plans to hire over 600 new employees, more than doubling its intake compared to early 2024. This substantial boost in recruitment is aimed at staffing two new semiconductor factories in Kumamoto Prefecture, Japan. The first facility is scheduled to commence chip production in 2024, with the second planned to open in 2027
Monday 8 July 2024
Japan revises upward semiconductor equipment sales forecast
The Semiconductor Equipment Association of Japan (SEAJ) has revised its forecast for fiscal 2024 (April 2024 to March 2025) sales of semiconductor equipment produced by Japan-based manufacturers. The new estimate projects a 15% year-on-year increase, reaching JPY 4.2522 trillion (approximately USD 27.1 billion). This represents an upward revision of over 5% compared to the January 2024 estimate
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