In recent years, advanced packaging has become increasingly crucial in high-performance computing, and Chinese OSAT companies, particularly Tongfu Microelectronics, are determined to seize this growing opportunity
Rapidus, aiming to begin mass production of 2-nanometer chips in Japan by 2027, is seeking significant financial support for its trial production and eventual mass production
Kioxia, currently ranked third in the global NAND market, is reportedly set to go public in Japan in October 2024. The move aims to secure funds for R&D and production capacity expansion to catch up with industry leaders Samsung Electronics and SK Hynix
Rumors have circulated about LG Electronics considering an IPO for its Indian unit, with reports indicating that the company is actively consulting investment banks for the potential listing
Since 2024, the global Electronic Design Automation (EDA) industry has seen considerable consolidation. The Chinese EDA sector, despite its long-standing fragmentation and early developmental stage, is beginning to follow suit
Rumor has it that Apple is seeking to partially reverse its production relocation, returning to China some of the manufacturing capacity it has had its suppliers move out of the country. But DIGTIMES sources familiar with the US vendor's ecosystem say this is unlikely
The South Korean government is rolling out a "Super eul" initiative to foster companies in the materials, components, and equipment sectors. This ambitious plan includes targeted support for research and development, accelerated commercialization, and financial backing, sparking interest across various industries
Hua Hong Group, one of China's two major semiconductor foundries, trails behind Chinese industry leader SMIC in terms of both capacity and market share, holding a global market share of only 2-4% and ranking sixth. However, Hua Hong is rapidly expanding its production capacity in mature process technologies
To seize the initiative in AI, the SK Group revealed that it is ready to use "three weapons," namely HBM, GTAA, and energy solutions. It hopes to sound the attack on the semiconductor, AI infrastructure, and AI service areas to strengthen future competition power
With TSMC expanding its presence in the United States, Japan, and Europe, many suppliers have followed suit, venturing abroad to establish new operations
Chinese smartphone manufacturers are preparing to make a strong push into the Indian wearable device market, a space traditionally dominated by local companies. It remains to be seen whether these Chinese firms will replicate their success in other sectors by outcompeting domestic players
Following a semiconductor collaboration with Malaysia, India further expanded its partnership with Singapore to include advanced manufacturing, semiconductors, aviation, and other sectors in their latest ministerial roundtable
Samsung Electronics reported a significant increase in memory chip production in the first half of 2024, surpassing 1 trillion chips. This surge is largely driven by a recovery in the memory market and Samsung's intensified focus on high bandwidth memory (HBM)
