SK Hynix (or "the company") announced today that it will showcase its innovative AI memory technologies at CES 2025, to be held in Las Vegas from January 7 to 10 (local time).A large number of C-level executives, including CEO Kwak No-jung, CMO (Chief Marketing Officer) Justin Kim, and Chief Development Officer (CDO) Ahn Hyun, will attend the event. "We will broadly introduce solutions optimized for on-device AI and next-generation AI memories, as well as representative AI memory products such as HBM and eSSD at this CES," said Justin Kim. "Through this, we will publicize our technological competitiveness to prepare for the future as a 'Full Stack AI Memory Provider1'."1Full Stack AI Memory Provider: Refers to an all-round AI memory provider, which provides comprehensive AI-related memory products and technologiesSK Hynix will also run a joint exhibition booth with SK Telecom, SKC, and SK Enmove, under the theme "Innovative AI, Sustainable Tomorrow." The booth will showcase how SK Group's AI infrastructure and services are transforming the world, represented in waves of light.SK Hynix, which is the world's first to produce 12-layer HBM products for the 5th generation and supply them to customers, will showcase samples of HBM3E 16-layer products, which were officially developed in November last year. This product uses the advanced MR-MUF process to achieve the industry's highest 16-layer configuration while controlling chip warpage and maximizing heat dissipation performance.In addition, the company will display high-capacity, high-performance enterprise SSD products, including the 'D5-P5336' 122TB model developed by its subsidiary Solidigm in November last year. This product, with the largest existing capacity, high power, and space efficiency, has been attracting considerable interest from AI data center customers."As SK Hynix succeeded in developing QLC2 (Quadruple Level Cell)-based 61TB products in December, we expect to maximize synergy based on a balanced portfolio between the two companies in the high-capacity eSSD market," said Ahn Hyun, CDO at SK Hynix. The company will also showcase on-device AI products such as 'LPCAMM23' and 'ZUFS 4.04,' which improve data processing speed and power efficiency to implement AI in edge devices like PCs and smartphones. The company will also present CXL and PIM (Processing in Memory) technologies, along with modularized versions, CMM(CXL Memory Module)-Ax and AiMX5, designed to be core infrastructures for next-generation data centers.2QLC: NAND flash is divided into SLC (Single Level Cell), MLC (Multi-Level Cell), TLC (Triple Level Cell), QLC (Quadruple Level Cell), and PLC (Penta Level Cell) depending on how much information is stored in one cell. As the amount of information stored increases, more data can be stored in the same area.3Low Power Compression Attached Memory Module 2 (LPCAMM2): LPDDR5X-based module solution that provides power efficiency and high performance as well as space savings. It has the performance effect of replacing two existing DDR5 SODIMMs with one LPCAMM2.4Zoned Universal Flash Storage (ZUFS): A NAND Flash product that improves data management efficiency. The product optimizes data transfer between an operating system and storage devices by storing data with similar characteristics in the same zone of the UFS, a flash memory product for various electronic devices such as digital cameras and mobile phones.5Accelerator-in-Memory based Accelerator (AiMX): SK Hynix's accelerator card product that specializes in large language models using GDDR6-AiM chipsIn particular, CMM-Ax is a groundbreaking product that adds computational functionality to CXL's advantage of expanding high-capacity memory, contributing to improving the performance and energy efficiency of the next-generation server platforms6.6Platform: Refers to a computing system that integrates both hardware and software technologies. It includes all key components necessary for computing, such as the CPU and memory."The changes in the world triggered by AI are expected to accelerate further this year, and SK Hynix will produce 6th generation HBM (HBM4) in the second half of this year to lead the customized HBM market to meet the diverse needs of customers," said Kwak Noh-Jung, CEO at SK Hynix. "We will continue to do our best to present new possibilities in the AI era through technological innovation and provide irreplaceable value to our customers."

Ampere, the intelligent electric EV pure player born from Renault Group and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the next step in their strategic co-operation, starting in 2026, with a multi-year agreement between STMicroelectronics and Renault Group on the supply of Silicon Carbide (SiC) power modules, as part of their collaboration on a powerbox for the inverter for Ampere's ultra-efficient electric powertrain. Ampere and STMicroelectronics worked together on the optimization of the power module, the key element in the powerbox, to get the highest performance and best competitiveness in the e-powertrain, leveraging Ampere's expertise in EV technology and STMicroelectronics' expertise in advanced power electronics."This agreement is the result of the intensive work carried out with STMicroelectronics. By working upstream together, we were able to optimize and secure the supply of key components for our electric powertrains, to offer high-performance EVs with increased range and optimized charging time. It perfectly aligns with Ampere's strategy to master the entire value chain of power electronics for its e-powertrain, leveraging STMicroelectronics' expertise in power modules," said Philippe Brunet, SVP of Powertrain & EV engineering, Ampere."ST is at the cutting edge of the development of advanced power electronics enabling the mobility industry to improve the performance of electrified platforms. With the optimization of these higher-efficient products and solutions to meet Ampere's performance requirements, and our vertically integrated silicon carbide supply chain, we are supporting Ampere's strategy for its next generation of electric powertrain," said Michael Anfang, Executive Vice President Sales & Marketing, Europe, Middle East and Africa Region, STMicroelectronics. "ST and Ampere share a common vision for more sustainable mobility and this agreement marks another step forward in improved power performance to further contribute to concrete improvements to carbon emissions reduction by the mobility industry and its supply chain."Power modules, composed of numerous silicon carbide chips, manage and convert electrical power from the battery to drive the electric motor. They play a crucial role in the efficiency of the electric powertrain and battery range, as well as energy regeneration features, making them a key element of the efficiency of an electric car. They also contribute to the smoothness and responsiveness of driving.STMicroelectronics and Ampere have collaborated on a powerbox for the supply of energy to Ampere's new generation of electric motors. The powerbox is designed for optimum performance-size ratio across Ampere's line-up, on 400 Volt battery EVs and for Segment C-EVs with 800 Volt batteries, enabling greater autonomy and faster charging. 800 Volts is one of the key levers to achieve the 10%-80% quick charge in 15 minutes or less. This agreement is fully aligned with Ampere's strategy to master the entire value chain of the electric vehicle, particularly by working further upstream with its partners and ensuring the best efficiency at each step.As an integrated device manufacturer (IDM), STMicroelectronics ensures the quality and security of supply to serve carmakers' strategies for electrification. The collaboration with Ampere on the silicon carbide power modules and powerbox demonstrates STMicroelectronics' leadership and system-level experience in advanced power electronics, including its packaging expertise.Additional Technical InformationThe powerbox combines three SiC-based power modules, an excitation module, which provides the necessary electrical excitation to the motor or generator for controlling the magnetic field within the motor, and a cooling baseplate designed to dissipate heat from the back side of the power module, simplifying the thermal management and cooling process.

Taiwan is a global leader in the information and communications technology (ICT) industry, boasting the world's highest output value in semiconductor foundry and IC packaging and testing. Taoyuan, in particular, plays a pivotal role, accounting for 90% of the shipments of high-end AI servers. Its diversified industrial clusters encompass intelligent medical technology, aerospace, the Internet of Things (IoT), and smart logistics, creating a robust and well-integrated supply chain for the AI industry.Taoyuan's strategic geographic location, coupled with its advanced shipping, maritime transportation, and outbound road network, has made it a hub for cross-border logistics carriers. This infrastructure has attracted investments from global industry leaders such as Microsoft, Supermicro, and aircraft parts supplier NORDAM. Notably, half of NVIDIA's 43 key suppliers are based in Taoyuan, contributing critical technologies and components to the global production of AI servers.The city's logistics and transportation capabilities have been further enhanced by the adoption of intelligent logistics technologies, significantly impacting the global semiconductor supply chain. This integration of cutting-edge equipment and expertise has solidified Taoyuan's position as a globally competitive industrial powerhouse.Taiwan's Leading Logistics Hub Driving the AI Supply ChainTaoyuan is close to major ports such as the Port of Taipei and has the only international airport in Taiwan that allows for express customs clearance, the highest density of warehousing and logistics in the nation, and a logistics and transportation system that leads the way in terms of international competitiveness.As the location of the Farglory Free Trade Port Zone, Taoyuan, as the world's first multi-functional "within and outside the border" free trade port zone, provides 24-hour logistics, cold chain, and aviation and other integrated services, and has a cargo terminal, a value-added park, and warehousing and office buildings, With the cargo terminal, value-added park, warehousing, and office buildings, air cargo express warehouse, cold chain logistics zone and integrated international logistics center, enterprises in the park can engage in simple processing, deep processing and 19 types of value-added operations, and they can also enjoy a number of preferential measures, such as convenient customs clearance, preferential taxation and more flexible hiring ratios of foreign workers, etc.The combination of the Aviation City and the neighboring industrial zones to form a "front store, back factory" and "inbound and outbound" mode of operation facilitates the speedy operation of air cargo and global logistics integration. This facilitates the rapid operation of air cargo transportation and the integration of global logistics, which helps the resident manufacturers to integrate their production and upstream and downstream supply chains and has gradually become a popular choice for the investment layout of internationally renowned manufacturers in recent years. For example, ASML has chosen Taoyuan as its logistics base in the Asia-Pacific region because of its proximity to the semiconductor bases in Hsinchu, Taichung, and Tainan, as well as its advantageous transportation location that can easily support the semiconductor clusters in Kumamoto, Japan, and Gyeonggi-Do, South Korea.To expand its logistic network in Taiwan, Coupang will open two large-scale logistics centers in the Evergreen Dayuan logistics park in 2022 and 2023. DHL will move into the International Logistics Park in Taoyuan in 2024 in order to expand its business layout and meet the needs of the semiconductor and medical industries, demonstrating that international logistics giants attach great importance to Taoyuan's transportation and logistics system.In addition, the Taoyuan Airpark Free Trade Zone can also engage in trading, customs clearance, assembly, processing, manufacturing, inspection, and testing. There are 19 businesses which also enjoy exemption from customs duties and goods taxes, etc. Whether it is upstream chips and embedded components, midstream industrial computers, communications equipment, and server components, to cloud, IoT solutions, etc. in the downstream, enterprises will benefit from Taoyuan's logistics and transportation system, which will enhance the global competitiveness of the domestic import and export-related industries.