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Wednesday 26 November 2025
Facing the rise of AI, how does Global Instrument Technology leverage Chunghwa Telecom's IDC for the manufacturing industry's AI-driven transformation
The manufacturing industry is facing major changes with the rapid development of artificial intelligence (AI) technology, which has made computing power and AI application services the "new oil" that fuels the competitiveness of enterprises. However, simply stacking hardware is not enough to run AI models, which are highly dependent on a stable and secure computing environment with low latency. The only way to ensure enterprise-level power, cooling, network bandwidth, and cybersecurity for the deployment of AI applications at scale is to set up the AI model in a professional Internet data center (IDC)
Thursday 27 November 2025
Fusion Worldwide: The Three Resources That Actually Gate AI Progress Right Now
From TSMC to SK hynix, every Q3 2025 earnings call delivered the same sobering message, the AI build-out is being throttled by three physical choke points that no amount of 2025 capex can fix fast enough. Leading-edge foundry, HBM memory, and advanced packaging are all sold out, not just for next quarter, but for the next three to five years. Here’s exactly where the wall is.High-Bandwidth Memory (HBM): The New KingmakerHBM has become the single most important component in the AI hardware stack and the scarcest. It’s no longer something you buy. It is something you reserve 18–24 months in advance and hope your allocation sticks.Reading the Q3 reports, Industry leaders have been blunt:SK hynix CFO Kim Jae-joon: "We have already sold out our entire 2026 HBM supply… supply expected to remain tight compared to demand into 2027."Micron CEO Sanjay Mehrotra: "Our HBM capacity for calendar 2025 and 2026 is fully booked."Samsung Memory: "Customers' demand for next year will exceed our supply, even considering our investment and capacity expansion plan."The consequences are cascading across the industry.The ripple effects are hitting the whole industry. Next-gen platforms like Blackwell Ultra, Rubin, AMD MI400, and everything coming after are now stuck behind memory limits. GPU and AI server lead times have stretched to 12–18 months, BOM costs are climbing, and procurement teams are buried in broker spreadsheets.Even worse, HBM expansion is eating into conventional DRAM. DDR5, LPDDR5, and even older DRAM lines are getting squeezed, setting up surprise shortages in laptops, smartphones, and cars through 2026.HBM has officially become the choke point for the entire AI sector.CoWoS Advanced Packaging: The Real Limit on GPU SupplyYou can have perfect 3 nm chiplets and pristine HBM stacks but without a CoWoS slot, you're holding an extremely expensive paperweight.TSMC’s CoWoS-L/S/R processes are what bind chiplets and HBM cubes using massive interposers and through-silicon vias. That assembly step, not silicon, is now the single most critical governor on AI GPU output.TSMC CEO C.C. Wei: "Our CoWoS capacity is very tight and remains sold out through 2025 and into 2026."NVIDIA CEO Jenson Huang: "CoWoS assembly capacity is oversubscribed through at least mid-2026," directly delaying volume Blackwell Ultra ramps.TSMC is expanding CoWoS capacity by roughly 60% in 2025 and 50% in 2026, but every new cleanroom module is spoken for long before it opens. AMD, Broadcom, Google, Amazon, Meta, everyone is fighting over the same finite packaging slots.Leading-Edge Foundry (3 nm/2 nm): Locked Up Until Late 2020sIf you didn't secure N3E or N2 production capacity back in 2023, you're effectively locked out.TSMC has been explicit:TSMC CEO C.C. Wei: "Frontend and backend capacity for leading-edge nodes is extremely tight… Customers' demand for the next year will exceed our supply, even considering our investment and capacity expansion plan."Apple consumed the bulk of N3 capacity for 2024–2025. What remained was divided among NVIDIA, AMD, Broadcom, and a handful of hyperscalers. TSMC's upcoming 2 nm fabs in Arizona and Kaohsiung won't reach meaningful output until late 2026 or early 2027, and much of that is already pre-allocated.Samsung's GAA roadmap is still trailing on yield and power efficiency, leaving nearly the entire industry dependent on a single geographic region.For any AI startup or any new chip program that didn't book capacity during the 2023–2024 scramble, the earliest possible tape-out now lands around 2028–2029.The Zero-Slack Era: 2026–2027 Demand Already 30–50% Above Planned SupplyThe most chilling part? Every CEO said the same thing, almost word-for-word:TSMC: "We are working very hard to narrow the gap between demand and supply."SK hynix, Micron, Samsung, Intel, NVIDIA-all echoed that even after $200 billion+ of collective capex, supply will still fall 20–50% short of demand in 2026 and 2027.If you are tired of hearing "fully booked through 2027" and watching your roadmaps slip quarter after quarter, talk to Fusion Worldwide. We specializes in AI ICs procurement, providing real-time visibility into ICs availability across all major manufacturers. Our E-commerce platform delivers instant availability checking, automated quote management, and rapid fulfillment capabilities that help procurement teams secure critical storage components even in constrained markets.Don’t wait for the next earnings call to tell you the gap got worse. Get Out In Front, Move now.(Article Sponsored by Alan Chew, Global Director of Strategic Accounts, Fusion Worldwide, Singapore)
Monday 24 November 2025
VSORA and GUC Partner on Jotunn8 Datacenter AI Inference Processor
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced a collaboration with VSORA to deliver turnkey ASIC design services supporting the onschedule tapeout of the Jotunn8 datacenter AI inference processor. Through this partnership, GUC showcased deep capability in complex chiplet architectures and HBM3E integration using 2.5D advanced packaging technology, reinforcing the company's strength in accelerating customer innovation with optimized performance and efficiency.Jotunn8 is VSORA's flagship AI-inference chip, engineered exclusively for inference workloads rather than training. It delivers ultra-low latency and very high throughput by overcoming the memory wall bottleneck, making large-scale, cost-efficient AI deployment viable.GUC delivered comprehensive design services for Jotunn8, managing the entire process from  netlistin through manufacturing. The solution integrates GUC's Advanced Packaging Technology (APT) IP portfolio, including 17.2 Gbps GLink-2.5D die-to-die interconnect and 8.4 Gbps HBM3E PHY & Controller, leveraging 3x-reticle 2.5D advanced packaging and 5nm process technology.GUC's contributions included complex physical design, chiplet partitioning and integration, as well as cooptimization of signal, power, and thermal integrity (SI/PI/TI). The team also achieved considerable IR and power optimization, enabling superior power efficiency and overall system performance. This collaboration positions VSORA to meet the demanding compute and bandwidth requirements of hyperscale datacenter inference workloads and underscores GUC's leadership as a trusted partner for AI and HPC ASIC development."Jotunn8 is Europe's first HBM-equipped datacenter inference processor, delivering unprecedentedoptimization across speed, efficiency, and scalability," said Khaled Maalej, Founder and CEO of VSORA. "GUC's excellence in physical design, die-to-die and HBM IP performance, and advanced packaging expertise played a pivotal role in achieving this milestone tape-out. Their rigorous engineering discipline and collaborative mindset have been instrumental in turning our ambitious vision into silicon reality.""GUC is honored to help bring VSORA's advanced AI processor to market," said Patrick Wang,Vice President and Chief Sales Officer at GUC. "VSORA's 2.5D design presented significant technical complexity. By combining their groundbreaking innovations with GUC's engineering excellence in advanced process and packaging technologies, we successfully enabled the Jotunn8 tape-out milestone. We look forward to supporting VSORA's vision for high- performance inference at scale and partnering on future generations of AI processors."Building on this success, VSORA and GUC are advancing the frontiers of AI compute. By combining deep innovation with execution excellence, the partnership paves the way for a new era of scalable, energy-efficient AI solutions for global data centers.For more information about GUC, please visit.For more information about VSORA, please visit.
Monday 24 November 2025
Leading the Liquid Cooling Revolution: Southco's Blind Mate Floating Mechanism Empowers Efficient Cooling in Data Centers
Global computing power is growing aggressively and pushing high-density chip power consumption. As this power density increases, traditional air cooling is reaching its physical limits, and once-fringe liquid cooling technology, boasting thermal efficiency hundreds of times greater than air cooling, is rapidly becoming core infrastructure.Driven by global sustainability targets and the need for high-performance, energy-efficient infrastructures, new large data centers must achieve their targeted PUE values, accelerating the industry towards large-scale liquid cooling. However, reliability issues stemming from insufficient mechanical tolerances at the connection points of liquid cooling systems are becoming a critical bottleneck for energy efficiency upgrades and stable operation. Southco recognizes the severity of this challenge and is committed to providing breakthrough solutions.Minor Deviations, Major CostsDuring the large-scale deployment of liquid cooling technology, the reliability of connection interfaces is vital. According to key data from the Open Compute Project (OCP) "Rack-Mounted Manifold Requirements and Verification Guidelines," a mere 1mm increase in mechanical deviation at liquid cooling interfaces can significantly raise system flow resistance by 15%, leading to a 7% increase in pump energy consumption!This is no trivial amount; in a hyperscale data center with thousands of interfaces, it translates to millions of kilowatt-hours of additional energy consumption and substantial operational costs each year. More concerning is that traditional rigid connection solutions typically offer only ±0.5mm of static tolerance, which proves inadequate in complex real-world environments like these:1. Accumulation of Multi-Dimensional Installation Deviations: In mixed deployment scenarios of widely used EIA-310-D standard racks and advanced ORV3 open architectures, rack installation tolerances can accumulate up to ±3.2mm, far exceeding the limits of traditional solutions.2. Dynamic Vibration Impacts: In ISTA 3-E vibration tests simulating real transportation and operating environments, interface displacement often exceeds 2.8mm, posing significant risks of leaks or connection failures.3. Material Thermal Expansion Effects: Under a typical temperature change of 55°C, copper alloy manifolds can expand approximately 1.2mm per meter, continuously challenging fixed interfaces.These dynamic, multi-dimensional deviations underline the urgent need for an intelligent, reliable sealing connection solution to ensure the long-term, efficient, and safe operation of liquid cooling systems.Blind Mate Quick Disconnect: A Connection for a Dynamic WorldAs a century-old expert in precision engineering, Southco confronts this challenge head-on with the launch of the revolutionary new "Blind Mate Floating Mechanism" liquid cooling connection solution. This innovation is not just a new product; it is a systematic response to profound insight into industry pain points.Current Status and Trends of Blind Mate Floating TechnologyLiquid cooling technology is rapidly gaining traction in high-performance computing (HPC), AI training clusters, and hyperscale data centers. Blind mate technology allows devices to connect without precise visual alignment, making it a core interface solution for rapid deployment and efficient maintenance in liquid cooling systems (especially cold plate systems). The development trends are clear:1. Higher Tolerance Capacity: Adapting to more complex rack environments and dynamic changes is essential.2. Increased Reliability: Zero leakage, long lifespan, and resistance to extreme conditions are basic requirements.3. Intelligent Integration: Integrating sensors for flow, temperature, pressure, etc., for real-time monitoring and predictive maintenance is a future direction.4. Standardization and Compatibility: Supporting OCP ORV3 and other open standards for seamless integration across platforms and manufacturers.Standard ISO 11926-1 threaded interface design, compatible with OCP UQD/UQDB connectors, and custom designs are available.5. Lightweight and Compact Design: Meeting the demands of higher density deployments.Southco's Blind Mate Floating Mechanism exemplifies innovative design centered around these core trends.Advantages Over Traditional SolutionsCompared to traditional fixed or simple floating heat transfer connection solutions, Southco's "Blind Mate Floating Mechanism" offers a qualitative leap with advantages evident across multiple dimensions.1. Three-Dimensional Dynamic Tolerance Control: Southco’s innovative design features a groundbreaking three-dimensional dynamic compensation mechanism: ±4mm of floating tolerance in the radial direction (2° tilt compensation) and 6mm of displacement absorption capacity in the axial direction. This far exceeds common static tolerances in the industry, effectively absorbing and adapting to all previously mentioned installation tolerances, vibration displacements, and thermal expansion deformations.2. Self-Centering Mechanism: When the liquid-cooled blind-plug connector is unplugged, the floating structure automatically resets to the center position, ensuring sufficient floating space for plugging and unplugging operations, fully meeting the strict tolerance requirements of OCP and ORV3 standards.3. Outstanding Sealing Performance for Long-Term Operation: Products endure rigorous ASME B31.3 standard 300psig burst pressure tests, ensuring over 10 years of service life, providing long-term stability for data centers, an achievement traditional solutions cannot match.4. Efficient Maintenance and Significant Cost Reduction: Featuring the Universal Quick Disconnect Blind (UQDB) interface, the design enables genuine "blind operations," allowing server maintenance without precise alignment or specialized tools. Quick disconnect capabilities make server replacement or upgrades as convenient as "hot plugging," reducing downtime and related losses by over 90%.Blind Mate Floating Mechanism. Credit: SouthcoThe Necessity of Blind Mate Floating MechanismIn AI computing clusters and next-generation data centers, adopting advanced connection solutions like Southco's "Blind Mate Floating Mechanism" is no longer optional, but essential.1. Key to Overcoming Cooling Bottlenecks: High power density is an inevitable trend; traditional cooling and rigid connections can no longer meet the demand. The Blind Mate Floating Mechanism is foundational for unleashing the full potential of liquid cooling and ensuring efficient, stable operation of cooling systems.2. Cornerstone of Business Continuity: The costs of data center downtime are immense. The rapid, reliable thermal maintenance supported by the Blind Mate Floating Mechanism is vital for ensuring uninterrupted operation of critical business activities 24/7.3. Core to Achieving Green and Low-Carbon Goals: Minor deviations in connectors leading to increased flow resistance can significantly elevate pump energy consumption. Its high-tolerance, low-flow resistance design directly contributes to lowering data center PUE values, making it an important element in energy conservation and emissions reduction goals.4. Flexibility for Future Expansion and Upgrading: Modular and standardized design enables data centers to expand capacity and upgrade equipment more flexibly, easily accommodating future increases in computing power demand and technological iterations.Continuous Innovation, Intelligent Cooling AheadAccording to the "Open Rack V3" white paper, liquid cooling penetration in hyperscale data centers is expected to exceed 40% by 2025. Southco continues to invest in R&D to iterate floating mechanism technology:1. Exploring lightweight high-performance materials (like PPSU thermoplastic) to reduce weight while maintaining strength.2. Advancing intelligent sensor integration for real-time monitoring of key parameters like flow and temperature, providing data for predictive maintenance and energy efficiency optimization.3. Deepening ecosystem collaboration and standardization to promote liquid cooling interfaces in higher density, lower TCO, and broader applications.As liquid cooling technology transitions from optional to essential, Southco's "Blind Mate" represents a precision engineering product innovation, and a profound understanding of cooling challenges in the data center industry. By integrating over a century of precision mechanical design expertise with innovative three-dimensional dynamic tolerance control technology, Southco strives to help global data centers break through cooling bottlenecks, building a more efficient, reliable, and greener foundation for computing power, empowering infinite possibilities in the digital age.For more information, please click here for more details.