After memory products like NAND Flash and DRAM, it's reported that Samsung Electronics will conduct R&D for a "3D stacking" technology that can vertically stack system semiconductor...
Recently, Samsung Electronics has been catching up in terms of advanced wafer foundry process technology. As its 3/4nm yield rates gradually improve, the South Korean industry expects...
TSMC will hold a ceremony on December 6 to mark the installation of the first batch of equipment at its new Arizona fab in the US, with participants including company founder Morris...
TSMC has seen its major clients including AMD, Apple, Broadcom, Intel, MediaTek, Nvidia and Qualcomm queue up for 3nm process capacity, according to sources at fab toolmakers.
