TSMC is expected to maintain full utilization of its 5/4nm and 3nm fabrication capacity through the end of this year, though uncertainties loom regarding policy changes following...
TSMC will hold its quarterly investors meeting on January 16, where its insights into semiconductor market trends for 2025 and its gross margin sustainability will be of considerable...
TSMC has received an influx of orders for CoWoS and other chipmaking equipment, the majority of which require super hot runs (SHR), according to industry sources.
Hynix Semiconductor has announced its second-generation 1Gb DDR3 chip using 54nm process technology. The new 1Gb DDR3 chip available now in x4 and x8 configurations, and has been...
ProMOS Technologies issued a filing with the Taiwan Stock Exchange (TSE) on July 23 stating that its agreement with Hynix Semiconductor on 54nm DRAM manufacturing has been terminated...
Hynix Semiconductor has announced the development of 1Gb DDR2 mobile DRAM using 54nm process technology for high-performance mobile applications. Mass production of the device is...
Hynix Semiconductor, the world's second-largest computer memory maker, has announced its earnings results for first-quarter 2009 (ended March 31). The chipmaker recorded consolidated...
