The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging Manufacturing Program (NAPMP) has finalized US$1.4 billion in awards...
On December 5, the US Department of Commerce finalized grants under the CHIPS Incentives Program's Funding Opportunity for Commercial Fabrication Facilities, directing significant...
The U.S. government announced plans to invest up to $300 million in three advanced semiconductor packaging research projects located in Georgia, California, and Arizona. These projects...
Absolics, an affiliate of South Korean chemical material firm SKC and invested by Applied Materials, signed a Preliminary Memorandum of Terms (PMT) with the US Department of Commerce...
