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NEWS TAGGED ABSOLICS
Thursday 21 November 2024
U.S. government announces up to $300 million in funding to boost advanced semiconductor packaging
The U.S. government announced plans to invest up to $300 million in three advanced semiconductor packaging research projects located in Georgia, California, and Arizona. These projects...
Friday 24 May 2024
Absolics becomes first materials firm to get US CHIPS Act subsidy
Absolics, an affiliate of South Korean chemical material firm SKC and invested by Applied Materials, signed a Preliminary Memorandum of Terms (PMT) with the US Department of Commerce...
Tuesday 19 September 2023
Intel gearing up for glass substrate production for advanced packaging
Intel has announced that its first glass substrate for next-generation advanced packaging will enter mass production between 2026 and 2030.
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research