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    NEWS TAGGED ABSOLICS
    Tuesday 19 September 2023
    Intel gearing up for glass substrate production for advanced packaging
    Intel has announced that its first glass substrate for next-generation advanced packaging will enter mass production between 2026 and 2030.
    TCA
    BIZ FOCUS
    Mar 21, 15:44
    Taipei AMPA 2024, reshaping Taiwan automotive industry with focus on sustainability, innovation, safety and international connection
    Wednesday 20 March 2024
    Embedded World 2024: Cincoze to showcase industrial edge AI computing solutions
    Wednesday 20 March 2024
    Darveen makes strong debut at Embedded World 2024
    Tuesday 19 March 2024
    SK Hynix begins volume production of industry's first HBM3E
    RESEARCH INSIGHTS
    NearLink poised to serve as alternative to Wi-Fi and Bluetooth in China IT industry, says DIGITIMES Research
    NPUs to become new AI accelerator chip option for edge devices, says DIGITIMES Research
    Operation O-RAN: The US plan to neutralize Huawei (and why it will work)