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    TSMC to double CoWoS capacity in 2025; Nvidia will use 60%
    9h 43min ago
    Drone developer Thunder Tiger eyes strategic tie with NextVision
    9h 53min ago
    HBM memory supply to scale in 2025
    10h 15min ago
    China solar energy market remains plagued by low prices
    10h 18min ago
    Despite start of new AI server shipments, server ODMs see gross margins fall
    10h 27min ago
    Server component providers welcome new era with Nvidia GB200 mass production
    10h 32min ago
    PCB and CCL firms gearing up for AI server boom
    10h 41min ago
    GB200 peripheral chip suppliers delighted with Blackwell cooling issues addressed
    10h 44min ago
    First Dimensity 9400 AI mobile phone debut; Vivo expects X200 sales to treble
    10h 52min ago
    NEWS TAGGED AMD NEO
    Friday 16 January 2009
    AMD adds new CPUs, a chipset and packaging technology to its embedded lineup
    AMD has added two new CPUs (Sempron 200U and 210U), a new chipset (780E) and ASB1 ball grid array packaging technology to its embedded lineup.
    Wednesday 7 January 2009
    AMD delivers new platform for ultra-thin notebooks
    AMD has announced the availability of an new AMD platform for ultra-thin notebooks.
    Holtek
    BIZ FOCUS
    Nov 21, 09:56
    SK Hynix starts mass production of world's first 321-high NAND
    Thursday 21 November 2024
    Simmunome: Revolutionizing drug development with tech bio innovation
    Wednesday 20 November 2024
    VitalTracer's path to innovation: Revolutionizing remote patient monitoring
    Tuesday 19 November 2024
    From Canada to Asia: PragmaClin's mission to improve Parkinson's Disease diagnosis and care
    RESEARCH INSIGHTS
    Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
    SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
    Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research