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    NEWS TAGGED ASE
    Monday 11 May 2026
    ASE, Wus to jointly build Kaohsiung advanced packaging plant by 2029
    Advanced Semiconductor Engineering (ASE) and PCB manufacturer Wus Printed Circuit are teaming up to build a new packaging facility in southern Taiwan, as the world's largest chip assembler...
    Monday 11 May 2026
    AI boom drives Taiwan's semiconductor testing industry into record expansion

    To secure a foothold in the booming market for advanced AI chip packaging and testing, Taiwan's outsourced semiconductor assembly and test...

    Monday 4 May 2026
    SPIL buys multiple Nanke plants to boost advanced packaging capacity for AI demand
    Siliconware Precision Industries Co., Ltd. (SPIL), a subsidiary of ASE Technology Holding, acquired two Nanke-area plants in 2026 from HannStar Display and its affiliate HannsTouch...
    Thursday 30 April 2026
    ASE Technology sees seasonality fade as AI demand drives steady 2026 growth
    Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held an earnings call on April 29, reporting a robust first quarter of 2026 that broke...
    Thursday 30 April 2026
    ASE raises 2026 capex to record US$8.5 billion on strong advanced packaging demand
    ASE Technology Holding Co. raised its 2026 capex plan to as much as US$8.5 billion as demand for advanced packaging and testing services exceeded expectations, the company said.
    Tuesday 28 April 2026
    ASE signs cybersecurity MOU with national institute to shore up semiconductor defenses
    Advanced Semiconductor Engineering (ASE) and the National Institute of Cyber Security signed a memorandum of understanding on April 28 to establish a joint cyber defense, intelligence...
    Monday 27 April 2026
    ASE Technology spotlights 18 suppliers at the forefront of a trillion-dollar AI wave
    Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held its 2025 ASE Supplier Award ceremony, inviting more than 100 suppliers of packaging...
    Friday 24 April 2026
    TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker
    The semiconductor packaging equipment sector is experiencing order shifts linked to significant executive changes at a key Taiwanese supplier, raising concerns over TSMC's chip-on-wafer-on-substrate...
    Sunday 19 April 2026
    ASE's CoPos advanced packaging accelerates as Skytech and CMIt boost equipment deliveries
    AI and high-performance computing (HPC) are driving increasingly stringent chip performance demands, marking a pivotal shift in advanced packaging technology from traditional wafers...
    Friday 17 April 2026
    Taiwan's OSAT expansion could tighten global test capacity and raise costs
    Taiwan's outsourced semiconductor assembly and test industry is expanding rapidly, driven by AI, high-performance computing, and memory demand. Global supply chains may face tighter...
    Thursday 16 April 2026
    ASE Holdings to acquire Innolux Fab 5 for US$460 million

    ASE Holdings has secured Innolux's Fab 5, with the company announcing on April 15 that its semiconductor unit's board had approved the...

    Monday 13 April 2026
    TPK and ASE to launch advanced semiconductor TGV packaging with 3Q26 pilot line
    Touch panel maker TPK is partnering with semiconductor packaging giant ASE to enter the advanced through-glass via (TGV) packaging technology sector, focusing on developing glass substrates...
    Saturday 11 April 2026
    ASE leads US$3.4B advanced testing push in Renwu
    Global OSAT leader ASE continued its expansion into advanced processes as its subsidiary ASE Test held a groundbreaking ceremony on April 10, 2026, at the Renwu Industrial Park. ASE...
    Tuesday 7 April 2026
    FOPLP and WMCM emerge as key to fan-out packaging competitive field
    The advanced packaging market is entering a structural turning point. Among emerging technologies, fan-out packaging has hit a sweet spot between cost and performance, making it a...
    Friday 27 March 2026
    Innolux sells Fab 2 to SPIL
    Innolux is selling multiple factories to strengthen its financial position and operations. Following an announcement of a standard factory sale to ChipMOS, Innolux disclosed on March...
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    BIZ FOCUS
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    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
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    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook