The AI investment cycle is spreading from leading-edge wafer fabrication into semiconductor packaging and testing, with Taiwan's largest...

As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from...

Scale and growth have decoupled. TSMC still supplies more than half the sector's monthly sales, but the growth table now belongs to...

TSMC, Micron, ASE, and SPIL continue to expand their advanced-node and OSAT investments, driving stronger first-half 2026 results for...

Co-packaged optics has become the inflection point for AI infrastructure, but the industry has not yet built the shared testing standards...

Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding (ASEH), broke ground on a new plant in Douliu, Yunlin...

Demand for AI infrastructure is forcing chipmakers and data-center operators to rethink how systems are built, with implications for...