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NEWS TAGGED ASE
Friday 6 February 2026
ASE expects advanced packaging and testing revenue to double in 2026
OSAT leader ASE Technology Holding is optimistic that its growth momentum will extend through 2026 and beyond, benefiting from the short supply of advanced packaging and testing capacity...
Friday 6 February 2026
ASE Technology posts 3-year profit high on strong advanced packaging orders in 4Q25
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding held its earnings call, revealing that robust demand for advanced semiconductor packaging services...
Monday 2 February 2026
ASE ramps advanced packaging in Taiwan as SPIL scales central hub
ASE Technology Holding is accelerating capacity expansion across multiple locations to meet rising demand for advanced packaging and testing services, with projects underway in northern,...
Friday 23 January 2026
ASE Group's USI merges with EugenLight to expand silicon photonics module capacity in Vietnam
ASE Group's co-packaged optics (CPO) strategy is close to complete. In addition to launching advanced packaging solutions that integrate optical engines (OE) and application-specific...
Wednesday 14 January 2026
Advanced packaging crunch lifts ASE, KYEC to new highs
TSMC will hold its earnings call on January 15, 2026. Supply chain sources expect AI chip demand to remain strong in 2026, while TSMC's advanced packaging and testing capacity continues...
Monday 5 January 2026
TSMC's CoWoS outsourcing to ASE and Amkor challenges Samsung
As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...
Wednesday 31 December 2025
Taiwan OSATs boost spending as CoWoS supply tightens

Taiwan's leading semiconductor assembly and test providers are launching record capital spending programs to expand advanced packaging...

Monday 15 December 2025
TSMC to expand CoW Orders in 2H26 as OSAT CoWoS-like tech rises
As major US CSPs are ramping up ASIC development, the capacity gap in TSMC's CoWoS advanced packaging continues to widen. Thus, the rise of "CoWoS-like" capacity by OSAT providers...
Wednesday 10 December 2025
TSMC expands CoWoS capacity with Nvidia booking over half for 2026-27
Semiconductor equipment suppliers reveal that TSMC and non-TSMC players, including ASE, Amkor, and UMC, are accelerating the expansion of advanced packaging Chip on Wafer on Substrate...
Monday 8 December 2025
Geopolitics push AI chip packaging into Taiwan-US duopoly
Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip...
Friday 28 November 2025
Cheng Mei delivers first CoPoS equipment to ASE
Competing with leading players, Cheng Mei Instrument Technology recently delivered the first CoPoS measurement and inspection equipment to the ASE Group, aiming to break KLA Corporation's...
Tuesday 25 November 2025
ASE commits US$133 million to new Taiwan packaging plants to meet AI chip demand
ASE Technology Holding announced it will invest more than NT$4.2 billion (US$133.67 million) to acquire a new factory in the Zhongli District of Taoyuan, Taiwan, and simultaneously...
Friday 21 November 2025
ASE and SPIL draw attention as Nvidia pushes for expanded US packaging capacity
Nvidia reported strong third-quarter results for fiscal 2026 (ending October 2025), driven by robust sales of its Blackwell Ultra chips. Cloud data center revenue rose over 60% year-on-year...
Thursday 13 November 2025
Taiwan revises merger law to boost industrial holding companies
Following the success of ASE and Siliconware Precision Industries (SPIL) in forming a joint holding company, Taiwan's government is now expanding incentives to encourage more listed...
Friday 7 November 2025
ASE unveils AI-enhanced IDE 2.0 to accelerate chip design and packaging
ASE has announced a significant upgrade to its in-house integrated design ecosystem (IDE) platform, introducing IDE 2.0, which features AI integration to speed up design iterations...