In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics,...
The rapid growth of Artificial Intelligence (AI) and High-Performance Computing (HPC) is driving an urgent need for performance while grappling with high energy consumption.
Leading IC packaging and testing company, ASE Technology Holding Co., Ltd. reported a revenue of NT$45.82 billion for April, showing a monthly increase of 0.3% and a year-on-year...
Taiwan-based IC backend houses including ASE Technology, Chipbond Technology, ChipMOS Technologies, King Yuan Electronics (KYEC), Powertech Technology (PTI), and Sigurd Microelectronics...
The semiconductor industry is witnessing significant shifts influenced by geopolitical considerations. One recent case exemplifying this trend is King Yuan Electronics's (KYEC) sale...
King Yuan Electronics (KYEC) decided to sell its assets in China, another Taiwan-based OSAT major leaving China, as the US-China geopolitical tensions are reshaping the OSAT indust...
