Rapidus has established strategic partnerships with two leading electronic design automation (EDA) companies to expedite the mass production of next-generation semiconductor chips.
TSMC's high-performance computing (HPC) revenue share continued to rise in Q2 2024, boosting overall performance. Although Samsung Electronics aims to increase its HPC sales proportion,...
Samsung Electronics unveiled its next-generation process blueprint at the Samsung Foundry Forum 2024 (SFF 2024), but the response from the semiconductor industry has been somewhat...
Samsung has announced plans to expand its support for DSPs (Design Service Partners) to help South Korean IC design companies deepen their presence in the HPC (High-Performance Computing)...
Samsung Electronics is introducing the 1.4 nm process, BackSide Power Delivery Network (BSPDN), and Silicon Photonics (SiPh) technologies by 2027 to enhance its AI solution strategy...
In a fierce race with TSMC and Intel to develop next-generation chipmaking processes, Samsung Electronics is reportedly accelerating its adoption of BackSide Power Delivery Network...
As TSMC and Intel announced in succession that they are conducting R&D for the back-side power delivery network (BSPDN) technology, Samsung Electronics recently shared the current...
