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Thursday 17 June 2021
Tong Hsing to expand packaging capacity for automotive CIS
Backend house Tong Hsing Electronic Industries plans to expand production capacity in three phases for automotive CMOS image sensors (CIS), while Chinese peers are also enforcing...
Thursday 17 June 2021
PCB makers Apex, Chin-Poon to expand capacity in Thailand
Taiwan-based PCB maker Apex International, with main manufacturing operations in Thailand, plans to invest NT$3.74 billion (US$135.1 million) to build new production lines at its...
Thursday 17 June 2021
Ansys multiphysics solutions achieve certification for TSMC N3 and N4
Ansys has achieved certification of its cutting-edge multiphysics signoff solutions for TSMC's advanced N3 and N4 process technologies, according to the EDA company. This enables...
Wednesday 16 June 2021
Taiflex, AEM to build new FCCL capacity for smartphone clients
Taiwan-based Taiflex Scientific and Asia Electronic Material (AEM), dedicated to supplying FCCL and other flexible PCB materials, both plan to build additional production lines to...
Wednesday 16 June 2021
ASRock optimistic about 2Q21
ASRock is upbeat about its sales and profit performance in the second quarter of 2021, citing strong demand for graphics cards, industrial PCs and servers.
Tuesday 15 June 2021
Malaysia lockdown may affect capacity sufficiency at IDMs
The ongoing lockdown in Malaysia is posing new variables to capacity deployments at many international automotive IDMs, further fueling competitions between ICT and auto makers for...
Tuesday 15 June 2021
PSMC negotiating orders for 2023
Taiwan-based pure-play foundry Powerchip Semiconductor Manufacturing (PSMC) continue to see orders demanding 8- and 12-inch wafer fabrication services pull in, and is in talks with...
Tuesday 15 June 2021
DDI backend services, materials see order visibility throughout 2021
Display driver IC (DDI) backend specialists ChipMos Technologies and Chipbond Technology, and related COF and COG packaging materials vendors including Niching Industrial have seen...
Friday 11 June 2021
MediaTek posts record May revenue
MediaTek has reported revenue climbed about 13% on month and nearly 90% from a year earlier to a record high of NT$41.33 billion (US$1.49 billion) in May 2021.
Friday 11 June 2021
Global smartphone AP market posts double-digit growth in 1Q21
The global smartphone applications processor (AP) market surged 21% on year to US$6.8 billion in the first quarter of 2021, according to Strategy Analytics.
Thursday 10 June 2021
TSMC posts increased May revenue
TSMC has reported revenue grew 0.9% sequentially and 19.8% on year to NT$112.36 billion (US$4.06 billion) in May 2021.
Thursday 10 June 2021
IC analyzers sees booming demand for advanced foundry, packaging
Taiwan-based specialists in semiconductor materials analysis, IC test and verification services will see their sales for the second half of the year driven by continuous R&D on...
Thursday 10 June 2021
Taiwan foundries poised to post record 2Q21 revenues
TSMC, United Microelectronics (UMC), Vanguard International Semiconductor (VIS) and Powerchip Semiconductor Manufacturing (PSMC) are poised to see their second-quarter revenues hit...
Wednesday 9 June 2021
Fuzetec to sustain full capacity for protective components till October
Taiwan-based Fuzetec Technology, dedicated to offering polymeric positive temperature coefficient (PPTC) thermistors and other circuit protection solutions, is expected to maintain...
Wednesday 9 June 2021
Aluminum capacitor demand to stay robust
Aluminum electrolyte capacitor demand will stay robust for applications ranging from notebooks, game consoles, servers to automotive electronics, and will continue to outpace supply...