Infineon's decision to accelerate investment to expand AI power capacity is set to lift fiscal 2026 capital spending and intensify fab loading management, even as the company maintains...
Vanguard International Semiconductor (VIS) forecasts that the semiconductor market in 2026 will be driven primarily by expanding AI investments and applications, which will broadly...
Vanguard International Semiconductor (VIS) held its earnings call on January 3, 2026, projecting wafer shipments to rise 1-3% quarter-over-quarter in the first quarter of 2026 as customer...
Advanced Micro Devices (AMD) signaled a focus on operational execution and supply-chain readiness during its February 3, 2026, earnings call, positioning the first half of 2026 as...
Recent market speculation has claimed that China's memory producer CXMT is triggering a price war by offloading DDR4 at deep discounts. Supply chain sources, however, said CXMT has...
Amid an acute global memory chip shortage, China's leading manufacturers ChangXin Memory Technologies (CXMT) and Yangtze Memory Technologies (YMTC) are rolling out their most aggressive...
The structural shortage in the memory market is driving a surge in supply chain operations, with reports indicating that Winbond recently finalized its contract pricing for the first...
Rising raw material costs and exchange rate fluctuations have driven upstream panel material suppliers in China to raise prices on glass substrates, polarizers, target materials, and...
Memory packaging giant Powertech Technology is aggressively expanding into fan-out panel-level packaging (FOPLP), with chairman Duh-Kung Tsai optimistic about the AI industry. Amid...
Memory shortages are worsening across the market as international suppliers shift capacity aggressively toward servers, tightening supply for consumer electronics and automotive sectors...
Rising prices are no longer limited to upstream materials and PCBs; surging memory costs have further pushed up supply chain expenses, prompting synchronized responses across wafer...
Before Intel released its latest earnings report, market sentiment was unusually upbeat. In a DIGITIMES podcast program, DIGITIMES analyst Luke Lin noted that expectations were buoyed...
Kinsus, the IC substrate arm of Pegatron, has approved additional project-based capital spending totaling NT$23.5 billion (approx. US$744 million) to support ABF substrate equipment...
As Intel, Samsung Electronics, and TSMC increase investment in advanced packaging, market sources say SMIC has set up an advanced packaging research organization in Shanghai, with...
