News tagged capacity at DIGITIMES

NEWS TAGGED CAPACITY

Friday 22 May 2026

AMD deepens China packaging alliance with TF-AMD expansion in Suzhou

AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics),...

Friday 22 May 2026

Samsung's quiet Taiwan play: Pairing memory with foundry to chip away at TSMC

Samsung Electronics chairman Lee Jae-yong quietly visited Taiwan on May 21 and met with MediaTek CEO Rick Tsai, according to semiconductor supply chain sources, in a move aimed at...

Friday 22 May 2026

AMD backs Taiwan EFB packaging chain to cut CoWoS reliance

AMD said it plans to invest more than US$10 billion in Taiwan's technology ecosystem to accelerate AI infrastructure development, while...

Friday 22 May 2026

TSMC supply chain material maker AMC rides AI packaging yield boom

Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has...

Friday 22 May 2026

AI memory crunch pushes Nanya Technology toward 2027 fab ramp

Nanya Technology plans to raise 2026 capital expenditure above NT$52 billion (US$1.64 billion), with chairman Tzou Ming-jen saying the...

Friday 22 May 2026

French AION consortium to bid for EU funding to build ?10B AI data center campus

A French consortium called AION said it would bid for EU AI infrastructure funding to build a large AI data center campus in France worth as much as EUR10 billion (US$11.6 billion)...

Thursday 21 May 2026

AMD commits over US$10 billion to Taiwan ecosystem to expand AI packaging and infrastructure capacity

AMD said on May 21 that it plans to invest more than US$10 billion across Taiwan's semiconductor ecosystem to deepen strategic partnerships and expand advanced packaging capacity for...

Thursday 21 May 2026

AI chip boom strains ABF substrate supply chain

AI is shifting the semiconductor supply chain's next bottleneck from wafer fabrication and HBM memory to ABF substrates — a lower-profile but critical packaging material used...

Thursday 21 May 2026

OpenAI offers 1-3 year reserved AI capacity with discounts to attract enterprise contracts

OpenAI launched a Guaranteed Capacity program that lets enterprise customers reserve one to three years of AI computing resources in advance, aiming to provide a stable supply for...

Thursday 21 May 2026

SK Hynix reportedly shifts Cheongju mask fab toward HBM yield push

SK Hynix is reportedly moving to reshape part of its Cheongju campus around wafer testing, a shift that underscores how high-bandwidth memory, or HBM, is putting new pressure on the...

Thursday 21 May 2026

China uses iron-fist policies to expel inefficient TOPCon capacity from solar supply chain

China's top-down policies are creating a tech elimination battle in its solar supply chain. Because of severe oversupply in the mainstream N-type tunnel oxide passivated contact (TOPCon)...

Thursday 21 May 2026

Tokuyama to build second high-purity IPA plant in Taiwan to bolster global semiconductor supplies

In a press release on May 20, Japan-based Tokuyama Corporation said it will build a second high-purity isopropyl alcohol plant in Kaohsiung through its joint venture with Formosa Plastics,...

Thursday 21 May 2026

TSMC's cautious capex is averting an AI bubble, says investor

TSMC's restrained expansion strategy is helping the global market avoid an AI bubble, according to veteran semiconductor investor Gavin Baker, the chief investment officer at Atreides...

Thursday 21 May 2026

Limited joint-load capacity threatens humanoid robots' ability to replace human labor

Humanoid robot developers and suppliers are increasingly focused on joint-module load-bearing capabilities as a key barrier to replacing human workers, according to supply-chain sources...

Wednesday 20 May 2026

Tech Forum 2026: AI server racks push liquid cooling into mainstream

META Green Cooling Technology (MGC) president Clyde Chu said Nvidia's chip roadmap shows that cooling requirements are doubling in less than a year, with the NVL72 rack based on the...

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Apr 28, 08:00

AI anti-fraud solution wins virtual asset security hackathon

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook