Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4...
Taiwan is racing to expand its AI compute capacity as demand for AI chips, GPUs and AI servers surges, with compute infrastructure now central to national competitiveness. According...
Gary Huang, vice president and head of Asia-Pacific research and business development at Yole Group, said the imbalance is already showing signs of what he described as supply-chain...
The European Space Agency (ESA) announced on August 27 that it had signed the first contracts under its European Launcher Challenge, signing agreements with European space startups...
China's 6-inch silicon carbide (SiC) substrate market is undergoing a structural supply-demand reversal. Driven by strengthening downstream demand and limited production restarts,...
Korea Electric Power Corp. (KEPCO) has proposed that Samsung Electronics and SK Hynix prepay as much as KRW25 trillion (approx. US$18 billion) in electricity bills as South Korea looks...
Niching Industrial is expanding its heat-spreader capacity as AI and high-performance computing demand pushes up orders across the global semiconductor supply chain. The company said...
TSMC says surging AI demand is stretching the global chip industry beyond its usual planning cycle, with fast-changing procurement needs, labor shortages, and infrastructure constraints...
Intel's US$23 billion equity raise in August was pre-funding for a capacity build driven by demand and process confidence rather than distress, chief financial officer David Zinsner...
MediaTek CEO Rick Tsai said Taiwan's supply-chain capabilities are unmatched as the technology industry moves into the AI and robotics era, while joking that the chip designer will...
Unimicron chairman SC Chien said the company is working to ease the tightening shortage of AI substrates as MediaTek seeks capacity support for the next three years, during a public...
JPC Connectivity said demand tied to artificial intelligence infrastructure continued to strengthen in the second quarter of 2026, lifting orders for optical communications, high-speed...
Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory...
At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...
