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Tuesday 26 May 2026
Samsung's reported 900-layer V-NAND prototype puts NAND race with YMTC in focus
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has...
Tuesday 26 May 2026
Wiwynn expands US capacity as AI server boom strains power and supply chains

Taiwan-based AI server maker Wiwynn is accelerating its global expansion as surging demand for AI infrastructure creates mounting pressure...

Tuesday 26 May 2026
AMD and Nvidia deepen investments in Taiwan semiconductor ecosystem

When AMD CEO Lisa Su arrived in Taiwan on May 20, she announced plans to invest more than US$10 billion with local supply-chain partners...

Tuesday 26 May 2026
Win Semiconductors bets on optical and satellite communications growth
Facing expanding opportunities in both optical communications and satellite connectivity, Dennis Chen, chairman of Win Semiconductors, said the company is actively advancing a range...
Tuesday 26 May 2026
Samsung's P4 HBM push could worsen DRAM crunch in 2027

Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth...

Tuesday 26 May 2026
GlobalWafers rolls out phased GaN capacity expansion to ease supply crunch
Following GlobalWafers' shareholders' meeting on May 25, Chairperson Doris Hsu stated that the company's core compound semiconductor business, gallium nitride (GaN), is addressing...
Tuesday 26 May 2026
Commentary: Stellantis' capital shift signals quiet reshaping of Europe's auto industry

In recent weeks, Stellantis, one of the world's five largest automakers, unveiled an ambitious five-year plan titled

Tuesday 26 May 2026
GlobalWafers to increase prices, targets 4Q26 shipments for square wafers, Asia capacity fully booked
GlobalWafers held its shareholders' meeting on May 25, where CEO Doris Hsu stated that the semiconductor market in 2026 has gradually moved beyond 2025's two extremes, when only AI...
Tuesday 26 May 2026
Taiwan MLCC makers plug into AI server demand
AI servers are driving a surge in demand for high-end passive components, rapidly eating into multilayer ceramic capacitor (MLCC) capacity and extending lead times to more than 16–20...
Tuesday 26 May 2026
TECO completes Malaysia's Dynaciate acquisition to boost data center build capacity
TECO Electric & Machinery announced on the 25th that it signed an agreement to acquire about 78% of Malaysian engineering firm Dynaciate Engineering Sdn. Bhd. for roughly 200 million...
Monday 25 May 2026
Micron maps out HBM roadmap with 2027 HBM4E debut and custom AI memory designs
Micron Technology said persistent supply constraints and accelerating AI demand are shaping its long-term technology roadmap, with 1-gamma DRAM, G9 NAND, and next-generation HBM products...
Monday 25 May 2026
Lam Research CEO: New fabs alone will not solve chip bottlenecks
Lam Research CEO Tim Archer said artificial intelligence and robotics can help chipmakers improve fab productivity as the semiconductor industry faces memory capacity constraints,...
Monday 25 May 2026
Geopolitics and AI push US energy storage to record-breaking quarter
The US energy storage industry achieved its most successful first quarter of 2026 to date, driven by surging AI computing demands and growing concerns over fossil fuel reliability...
Monday 25 May 2026
Nan Pao joint venture nears full capacity as semiconductor demand rises

Nan Pao Resins Chemical is accelerating its push into the high-end semiconductor materials market through a joint venture with Advanced...

Monday 25 May 2026
Anthropic-Microsoft deal could broaden ASIC demand across cloud supply chains
Anthropic has reportedly approached Microsoft about renting AI computing power running on Microsoft's in-house chips to expand support for its Claude model business. The move is a...