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Friday 17 September 2021
MediaTek keen on enriching design talent pool
MediaTek has expanded its recruitment scale in Taiwan, looking to hire an additional over 2,000 design engineers to support its business expansion goals.
Friday 17 September 2021
High-speed transmission chip suppliers expect output value to boom
Taiwan's suppliers of high-speed transmission chips, which have obtained commitments from foundries to provide sufficient capacity support next year, are gearing up for a boom in...
Friday 17 September 2021
AiP substrate shipments for new iPhones set to rise
Suppliers of antenna-in-package (AiP) substrates for Apple's new iPhones are gearing up for a ramp-up in demand for mmWave models, according to industry sources.
Friday 17 September 2021
GaN Systems strikes deal with BMW
GaN Systems has announced the signing of a comprehensive capacity agreement with BMW Group for GaN Systems' high-performance, automotive-grade GaN power transistors, which increase...
Thursday 16 September 2021
GF, Qualcomm team up for advanced 5G RF front-end devices
GlobalFoundries (GF) has announced the foundry is continuing its partnership with Qualcomm, expanding their RF collaboration on 5G multi-Gigabit speed RF front-end products.
Tuesday 14 September 2021
DDI backend houses to strengthen high-end testing capacity expansions in 2022
Display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies will remain focused on expanding high-end testing capacity in 2022 to satisfy growing...
Tuesday 14 September 2021
US chip vendors increasingly shift orders from China foundries
US chip vendors have increasingly shifted their orders away from China-based foundries to mitigate potential risks arising from the ongoing trade tensions between the US and China,...
Tuesday 14 September 2021
SMIC to build additional, considerable 28nm and above process capacity
China's Semiconductor Manufacturing International (SMIC) will be expanding production capacity for 28nm and above process technologies by 2024, which will considerably boost its overall...
Monday 13 September 2021
Epistar to expand miniLED capacity by 50% in 2022
LED epitaxial wafer and chip maker Epistar has fully utilized production capacity for mini LEDchips used in backlighting and will expand the capacity by 50% in 2022, according to...
Monday 13 September 2021
Intel offering competitive prices to maintain server market leadership
Intel, facing AMD's fierce competition in the server market, is offering more competitive pricing for its server CPUs, with many cloud computing datacenter operators who have begun...
Friday 10 September 2021
Unimicron reports record August revenue
IC substrate and PCB maker Unimicron Technology enjoyed another month of record-high revenue in August, driven by robust orders and rising ASPs.
Friday 10 September 2021
Taiwan OSATs install additional wire-bonding equipment
Taiwan OSATs, including ASE Technology, Greatek Electronics, Lingsen Precision Industries and Orient Semiconductor Electronics (OSE), have all begun to install additional wire-bonding...
Friday 10 September 2021
China silicon wafer maker secures CNY3.3 billion in Series B
Hangzhou Semiconductor Wafer, a silicon wafer subsidiary owned previously by Japan's Ferrotec, has closed CNY3.3 billion (US$510 million) in its Series B funding round and will be...
Thursday 9 September 2021
Taiwan PCB output value up 19.7% in 1H21
Taiwan-based PCB manufacturers saw their combined output value reach NT$355.7 billion (US$12.62 billion) in the first half of 2021, up 19.3% on year and the highest-ever record for...
Wednesday 8 September 2021
Yageo capacity utilization stays above 90%
Yageo continues to utilize more than 90% of its production capacity for MLCC and chip resistors, as order momentum remains healthy despite shipment pull-in by clients more or less...