News tagged capacity at DIGITIMES

NEWS TAGGED CAPACITY

Monday 7 September 2026

Exclusive: Infineon COO says chip shortage recovery will take longer

Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at Semicon Taiwan 2026 that the current global chip shortage is unlike the one during Covid-19 and will...

Monday 7 September 2026

Phison snaps up low-cost China NAND inventory, AI revenue share set to top 40%

Phison CEO K.S. Pua expects NAND Flash supply to remain tight into 2027 despite capacity expansion across major memory makers, arguing that forecasts of a rapid return to oversupply...

Monday 7 September 2026

India's TCS unit secures land in Hyderabad for planned 1GW AI data center campus

HyperVault, a Tata Consultancy Services (TCS) subsidiary, has secured 264 acres in Hyderabad to build a large AI data center campus capable of reaching 1GW of capacity. The project...

Monday 7 September 2026

Weekly news roundup: AI memory race heats up, Taiwan manufacturing rebounds, Nexperia rift deepens

AI infrastructure and semiconductor supply chains led reader interest this week, from Taiwan's manufacturing recovery and Nexperia's legal battle to Sandisk's HBF, Micron's HBM expansion,...

Monday 7 September 2026

Wah Lee sees faster growth in 2027 as supply stays tight

Wah Lee Industrial expects growth to accelerate in 2027 as advanced packaging capacity comes online and foundries continue building overseas fabs, while tight supplies of semiconductor...

Monday 7 September 2026

China's JCET seeks US$968M for AI-driven packaging expansion

JCET Group is preparing a CNY6.5 billion (approx. US$968 million) private share placement to expand advanced packaging and testing capacity...

Monday 7 September 2026

No foundry price relief before 2027 as utilisation nears 90%

AI demand is driving a broader repricing cycle across the foundry industry in 2026. Tightness that began at leading-edge nodes is spreading...

Monday 7 September 2026

Experts say subsidies can't buy semiconductor competitiveness

At a forum jointly hosted by DSET and SEMI during SEMICON Taiwan this year, Glenn D. Tiffert of the Hoover Institution, Kioxia Holdings board member Emiko Higashi, and NRC...

Sunday 6 September 2026

Hiwin Mikrosystem targets SiPh inspection gear as capacity expands 20%, order visibility extends to 2Q27

Driven by the shift from copper to optical interconnects, silicon photonics (SiPh) and co-packaged optics (CPO) are moving rapidly toward mainstream adoption, fueling demand across...

Sunday 6 September 2026

Middle East tensions, Panama Canal limits can further tighten global shipping

Rising Middle East tensions, marked by the largest US-Iran military exchange since July, have once again cast a shadow of geopolitical escalation over the region. Meanwhile, recent...

Sunday 6 September 2026

Hanmi's 2.5D bonders pass Taiwan foundry qualification as packaging outsourcing expands

South Korea's Hanmi Semiconductor has reportedly begun supplying 2.5D packaging bonders to an unnamed Taiwanese foundry after the equipment passed mass-production qualification, giving...

Sunday 6 September 2026

Taiwan chip equipment maker Scientech sees orders into 2028, may turn away customers in 2027

AI and high-performance computing (HPC) demand is extending order visibility for Taiwanese semiconductor equipment supplier Scientech into 2028, while capacity constraints may force...

Saturday 5 September 2026

Micron looks to lock in Taiwanese construction capacity with long-term deals

The global rush to build semiconductor fabs is creating a historic opportunity for Taiwan's construction and facility engineering supply chain, and Micron Technology is looking to...

Saturday 5 September 2026

Commentary: China builds three-pronged memory strategy around CXMT, YMTC, XMC

China's memory industry is shifting from a single-champion model towards a three-pronged structure. ChangXin Memory Technologies (CXMT) is building its position in DRAM, Yangtze Memory...

Friday 4 September 2026

Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge

Micron is reportedly preparing to roughly double its high-bandwidth memory capacity by the end of 2026, targeting about 100,000 wafers a month while sharply increasing 12-high HBM4...

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Sep 2, 08:22

World Diamond Technology accelerates mass production of 300 mm diamond wafers

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