ASE Holdings posted record second-quarter and first-half 2026 revenue, driven by strong demand for advanced semiconductor packaging and...

Samsung Electronics' preliminary earnings have shaken financial markets. Drawing on a report from a US brokerage, DIGITIMES Intelligence...

TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly...

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

Chunghwa Precision Test Tech president Scott Huang said on July 7 that the company's biggest challenge over the next five years will...

High-bandwidth memory (HBM) prices could more than double in 2027 as Nvidia's Rubin platform drives demand, HBM4 raises production...

India's decision to clear a smartphone-manufacturing joint venture between Dixon Technologies and Vivo Mobile India could reset how...

Mitsubishi Chemical and Japan Steel Works are preparing a fresh capacity expansion in gallium nitride (GaN) substrates, aiming to capture...