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    Chenbro Micom sees AI-driven hardware surge bolstering global data center deployments
    2min ago
    Aspeed and ASMedia propelled to top IC design ranks
    1h 32min ago
    Meta launches Muse Spark to champion next-gen AI assistant
    1h 43min ago
    NEWS TAGGED CAPACITY
    Thursday 9 April 2026
    Samsung P4 fab nears completion, expanding 1c DRAM capacity
    Samsung has entered the final phase of equipment investment at its P4 fab in Pyeongtaek, issuing purchase orders (POs) for front-end tools for Phase 2 (Ph2) and Phase 4 (Ph4). According...
    Thursday 9 April 2026
    GITEX AI Asia opens in Singapore as focus shifts to infrastructure, deployment

    Artificial intelligence (AI) is moving beyond experimentation toward real-world deployment, as GITEX AI ASIA 2026 opened in Singapore,...

    Thursday 9 April 2026
    Samsung profit jumps on memory rally, chips drive over 90% of earnings
    Samsung Electronics posted record first-quarter 2026 results, with more than 90% of earnings tied to its memory business, underscoring the scale of the AI-driven memory upcycle.
    Thursday 9 April 2026
    China's EVE Energy ramps up capacity amid energy storage boom
    EVE Energy, one of China's largest battery manufacturers, said on April 7 that it expected strong profit growth in the first quarter of 2026 as demand for energy storage batteries...
    Thursday 9 April 2026
    Microloops rides AI boom, aims to double 2026 revenue
    Cooling module manufacturer Microloops has said its major cloud service provider (CSP) customer has been increasing pull-ins starting in the second quarterof 2026, driving significant...
    Thursday 9 April 2026
    China's memory capacity surge led by YMTC and CXMT shifts global supply in AI cycle
    Global memory markets are entering a new restructuring cycle driven by AI demand, with China's YMTC and CXMT scaling capacity and state-backed investment to gain share in a sector...
    Thursday 9 April 2026
    Geopolitics and AI is redrawing the global chip packaging landscape
    The AI computing boom is reshaping where semiconductors get packaged. Geopolitical pressure and supply chain diversification are pushing capacity well beyond its traditional strongholds...
    Thursday 9 April 2026
    AI chip demand tightens ABF substrate supply, three-year upcycle in sight
    As AI CPUs, GPUs, and application-specific integrated circuits (ASICs) advance to new generations, they are driving a sharp increase in both substrate size and layer counts. Simultaneously,...
    Thursday 9 April 2026
    Silicon Motion warns AI-driven NAND shortages will deepen in 2027, reshaping memory market
    Silicon Motion said AI-driven NAND supply constraints are causing structural shifts in the memory industry and warned the imbalance will worsen in 2027 as cloud service provider demand...
    Wednesday 8 April 2026
    Europe's battery ambitions shrink as costs and China's dominance loom

    Driven by the rapid shift toward automotive electronics and electrification, Europe moved earlier than the United States to localize lithium...

    Wednesday 8 April 2026
    Chinese SSD maker DapuStor sees rising QLC demand as AI drives storage growth
    Chinese enterprise SSD (eSSD) maker DapuStor entered its IPO subscription phase in early April 2026, driven by rapid expansion in AI infrastructure. The company recently observed multiple...
    Wednesday 8 April 2026
    SK Hynix begins supply of 321-layer QLC cSSD for the AI PC era
    SK Hynix has started global shipments of a next-generation compact SSD designed for AI-driven personal computers, a move that could reshape storage choices for device makers and end...
    Wednesday 8 April 2026
    Analysis: ASML earnings preview; SK Hynix and TeraFab already facing EUV capacity difficulties
    Compared to short-term geopolitical turbulence, the AI megatrend represents a once-in-a-generation business opportunity. In the past, TSMC often took the lead during earnings season...
    Tuesday 7 April 2026
    FOPLP and WMCM emerge as key to fan-out packaging competitive field
    The advanced packaging market is entering a structural turning point. Among emerging technologies, fan-out packaging has hit a sweet spot between cost and performance, making it a...
    Tuesday 7 April 2026
    Intel challenges TSMC CoWoS as Amazon, Google reportedly explore alternatives

    AI-driven demand is pushing advanced chip packaging to its limits, exposing constraints in TSMC's CoWoS capacity and forcing hyperscalers...

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    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook