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Saturday 19 September 2026
Power grids can't keep pace with AI data center boom in EU, US
According to supply chain players, most AI data center cost models used by analysts in both China and the West only count electricity consumption when estimating the cost of AI data...
Saturday 19 September 2026
Charts: Taiwan's memory makers are outgrowing TSMC by a factor of eight

Taiwan's chipmakers are having their best year in a decade, and the headline number belongs to TSMC. The more interesting one does n...

Saturday 19 September 2026
CXL adds memory capacity, but HBM retains its bandwidth edge

Growing memory requirements are increasing interest in Compute Express Link (CXL) as a way to add capacity beyond locally attached memory...

Saturday 19 September 2026
Ventec invests NT$1.5 billion in Kunshan expansion for AI, HDI orders

Copper-clad laminate (CCL) manufacturer Ventec International Group has approved an expansion budget of NT$1.5 billion (approx. US$47.11...

Friday 18 September 2026
Solidigm weighs first US NAND fab, explores upstate New York

Solidigm, the US NAND flash subsidiary of SK Hynix, is considering building its first NAND manufacturing plant in the US, with upstate...

Friday 18 September 2026
Winbond cements server NOR lead with Infineon deal
Winbond Electronics is expanding its NOR Flash footprint and has agreed to pay US$1.12 billion in cash to acquire Infineon's NOR Flash and F-RAM businesses, a move that will lift it...
Friday 18 September 2026
Doosan commits KRW968 billion to CCL expansion as demand strains capacity
Doosan is investing KRW968.4 billion (approx. US$701 million) to expand high-end copper-clad laminate (CCL) production in South Korea and China, its largest-ever investment in the...
Friday 18 September 2026
China's memory push gains ground across LPDDR6, advanced NAND, with HBM still the test

AI is reshaping the global memory industry, tightening supply while creating an opening for China's domestic suppliers. With Samsung...

Friday 18 September 2026
CoreWeave launches US$3 billion bond sale amid growing revenue, debt

CoreWeave launched a debt sale worth US$3 billion in convertible bonds, which would allow buyers to turn their bonds into shares. The...

Friday 18 September 2026
LGES, Samsung SDI reportedly booked out for two years as US restrictions and China slowdown reshape ESS market
As energy storage system (ESS) battery orders continue to accumulate at South Korean manufacturers, expectations are growing that market conditions could improve further. The outlook...
Friday 18 September 2026
Chip equipment makers face waits of up to 40 months for critical parts
The semiconductor industry's capacity crunch is moving deeper into the equipment supply chain, with shortages of specialized components stretching delivery times as chipmakers accelerate...
Friday 18 September 2026
Mobile SoC battle for 2026 centers on NPUs

More technical details on 2026 mobile systems on a chip (SoCs) from major vendors are emerging, and the biggest changes in chips such...

Friday 18 September 2026
Micron: AI memory crunch rewrites the market with long-term deals and custom designs
As the AI boom spreads from data centers to edge devices and robotics, Micron Technology executives are warning that memory has become a core bottleneck determining the upper limits...
Friday 18 September 2026
GlobalFoundries, Marvell expand SiGe capacity deal for AI optical connectivity

GlobalFoundries (GF) and Marvell Technology have expanded a multi-year agreement to increase production capacity for silicon germanium...

Friday 18 September 2026
Rumored Japan-US chip plant talks test whether two former chipmaking giants can rebuild at home

If the project under discussion goes ahead, it would be the first time Japan's US$550 billion tariff-linked investment pledge is directed...