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    Saturday 25 April 2026
    LandMark Optoelectronics ramps up semiconductor-grade equipment for 6-inch SiPh amid surging demand
    Silicon photonics (SiPh) products continue to see strong demand, with optical communication epitaxy manufacturer LandMark Optoelectronics reporting output still far below customer...
    Saturday 25 April 2026
    India's solar growth faces policy tension between local manufacturing push and rapid capacity expansion
    India's push to localize solar manufacturing while rapidly expanding capacity is creating a structural bottleneck, as stricter domestic sourcing rules risk constraining supply just...
    Friday 24 April 2026
    Chipmakers face higher cost pressure as packaging outpaces foundry price hikes
    In recent weeks, chip companies ranging from major players to small and medium-sized firms have issued price increase notices or begun renegotiating product prices with select customers...
    Friday 24 April 2026
    Microsoft and Meta announce workforce reductions amid heavy AI investment
    Microsoft and Meta have recently announced job cuts or buyouts impacting possibly 23,000 jobs. The staff reductions come as the tech giants funnel massive resources into building out...
    Friday 24 April 2026
    FSET eyes local battery recycling and storage by 2027
    Amid rising electricity demand driven by geopolitical tensions and AI growth, Formosa Smart Energy Tech (FSET) is advancing its battery recycling and energy storage strategy to build...
    Friday 24 April 2026
    AI PCB supply crunch squeezes margins on rising materials and energy costs
    A tightening supply of high-end materials is emerging as a key constraint just as PCB specifications and manufacturing processes move into a new upgrade cycle. Shortages span from...
    Friday 24 April 2026
    Zhen Ding to invest CNY40 billion in Huai'an to expand high-end PCB capacity

    Zhen Ding Technology has broken ground on its HD campus at the Huai'an Technology City in China, as it accelerates investment to expand...

    Friday 24 April 2026
    MCU supplier Artery weighs price hikes on AI capacity squeeze, new applications drive growth

    Microcontroller supplier Artery Technology (Arterytek or Arterychip) delivered a strong start to 2026, posting first-quarter consolidated...

    Friday 24 April 2026
    Intel flags price increases and supply shortages as CPU demand strengthens
    Intel signaled that industry-wide supply shortages and selective price increases are helping offset weaker PC demand, even as the company works to expand supply capacity across its...
    Friday 24 April 2026
    BizLink builds Southeast Asia manufacturing network with distinct roles across key markets

    Driven by geopolitical shifts and supply chain restructuring, Southeast Asia has become an important destination for Taiwanese electronics...

    Thursday 23 April 2026
    Volkswagen outlines aggressive EV, AI and capacity reset ahead of Beijing show
    Volkswagen's plan to launch 50 electric models by 2030 while cutting global production capacity signals major structural shifts for consumers, suppliers, and markets worldwide. The...
    Thursday 23 April 2026
    SK Hynix flags persistent HBM shortage as demand outpaces supply
    SK Hynix said demand for high-bandwidth memory is expected to outpace supply for several years, underscoring persistent constraints in the AI memory market even as the company ramps...
    Thursday 23 April 2026
    Lam Research signals sustained AI-driven momentum as WFE outlook improves
    Lam Research delivered a strong start to 2026, with first-quarter 2026 results exceeding expectations and reinforcing confidence in a semiconductor upcycle increasingly shaped by artificial...
    Thursday 23 April 2026
    Google debuts TPU 8t and 8i as AI workloads diverge
    Google Cloud Next 2026 kicked off on April 22 in Las Vegas, with Google Cloud CEO Thomas Kurian declaring that the experimental phase of artificial intelligence is over. Nearly 75%...
    Thursday 23 April 2026
    SK Hynix builds HBM packaging hub in Cheongju to expand AI memory capacity
    SK Hynix has broken ground on a large-scale advanced packaging facility in Cheongju Technopolis, underscoring how the battleground for AI semiconductors is shifting beyond wafer fabrication...
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook