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Thursday 12 March 2026
Ardentec launches ASIC wafer test collaboration; new Longtan capacity to be ready by 2H26
Semiconductor testing firm Ardentec is optimistic about its future operations, driven by sustained strong orders in communication applications. The company expects a resilient first...
Thursday 12 March 2026
Asia Vital Components plans major liquid cooling expansion, expects market shift
Asia Vital Components (AVC) chairman Ching-hang Shen said it will significantly expand liquid cooling production in 2026, calling the year the "liquid cooling era," and aims to boost...
Thursday 12 March 2026
SMIC flags supply squeeze in memory, BCD chips
China's largest contract chipmaker, SMIC, says orders for mature-node memory and BCD processes are running at full capacity, pushing prices higher as AI demand tightens supply across...
Thursday 12 March 2026
Chenbro highlights four risk factors amid promising AI server outlook
Chenbro CEO Corona Chen highlighted that the global server industry is undergoing a generational shift from cloud computing to AI, which will drive growth over the next decade and...
Thursday 12 March 2026
US slaps 16 nations with Section 301 probes: Taiwan and Korea in the crosshairs
The US Trade Representative announced the initiation of investigations under Section 301(b) of the Trade Act of 1974 into the acts, policies, and practices of several economies related...
Thursday 12 March 2026
Daxin expands capacity to meet rising semiconductor material demand
Daxin, a key player in semiconductor materials, has seen rapid growth in recent years. Currently, wafer process materials account for a larger share of revenue than advanced packaging...
Wednesday 11 March 2026
MiTAC ramps 2026 factory expansion to meet AI server and cloud demand, signaling bigger US footprint
MiTAC Holdings plans a significant increase in capex in 2026 to expand production capacity for networking equipment, general-purpose servers, and new AI server lines, driven by sustained...
Wednesday 11 March 2026
ASE breaks ground on AI advanced packaging site in Southern Taiwan, set for 2Q28 completion
ASE Technology Holding has broken ground on its third technology park in Nanzi, Kaohsiung, focused on advanced semiconductor packaging and smart logistics, with construction to start...
Wednesday 11 March 2026
Oracle says AI infrastructure projects are profitable and margins should improve as capacity comes online
Oracle told investors during its third-quarter fiscal-year 2026 earnings call that its AI infrastructure business is profitable today and should become more so as under-construction...
Wednesday 11 March 2026
NewPower Worldwide Expands Credit Facility to $500 Million

NewPower Worldwide, a leading independent distributor of electronic components and supply chain management solutions, today announced an expansion of its committed credit...

Wednesday 11 March 2026
Nvidia narrows CoWoP PCB partners to three amid advanced packaging crunch
Advanced packaging capacity is tightening, and Nvidia is quietly pushing its Chip-on-Wafer-on-PCB (CoWoP) technology forward. The company is working with PCB, semiconductor packaging,...
Wednesday 11 March 2026
Gemtek reports full-year revenue rise despite net loss after one-time charges
Gemtek Technology's board approved the financial report for 2025 on March 9, reporting full-year consolidated revenue of NT$16.493 billion (approx. US$520 million) and a gross margin...
Tuesday 10 March 2026
Zhen Ding posts slight 4% revenue drop in February amid strong AI demand
Major printed circuit board (PCB) manufacturer Zhen Ding Technology reported a slight 3.97% year-over-year decline in February 2026 revenue to NT$11.72 billion (US$367.45 million),...
Tuesday 10 March 2026
Nvidia to restart RTX 3060 with Samsung amid China curbs, Korean report says
Nvidia is preparing to resume production of its GeForce RTX 3060 graphics processing unit (GPU) through Samsung Electronics' foundry business, according to reports from the Korea...
Tuesday 10 March 2026
Taiwan-US memory, foundry, and packaging expansions surge; Malaysia and India reportedly face delays
The global semiconductor industry is rapidly expanding production capacity, with Taiwan, the US, and China accelerating memory, advanced packaging, and wafer foundry construction plans...