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Tuesday 19 March 2024
TSMC chooses CoWoS factory site while continuing 3nm capacity expansion
TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.
Tuesday 19 March 2024
Foxconn, Quanta, and Wistron have high hopes for AI servers
Taiwan-based ODMs and contract device manufacturers including Hon Hai Technology Group (Foxconn), Quanta Computer, and Wistron have high expectations for AI server sales this year.
Monday 18 March 2024
Visco Vision expands production capacity for contact lenses amid growing market demand
Taiwan-based Visco Vision, a specialist in contact lenses and a subsidiary of polarizer maker BenQ Materials, anticipates a surge in revenues for 2024, buoyed by strong support from...
Monday 18 March 2024
IntelliEPI expands epitaxy capacity as defense orders increase
Intelligent Epitaxy Technology Inc (IntelliEPI), a leading provider of epitaxy service for compound semiconductors like Indium Phosphide (InP), Gallium Arsenide (GaAs), and...
Wednesday 13 March 2024
Air cargo capacity shortage could be supply chain breaking point
The shipping industry, passenger or cargo, has slowly recovered to pre-COVID-19 levels. It is worth noting that since air cargo capacities were booked up by e-commerce demand, failing...
Tuesday 12 March 2024
Space battery pioneer Hitachi Zozen lands first all-solid-state-battery order
Hitachi Zozen has received its first commercial order for All-Solid-State Lithium-Ion Batteries (ASSLBs).
Thursday 7 March 2024
Backend houses gearing up for AI chip boom
The arrival of the Artificial Intelligence (AI) age has underscored the increasing importance of semiconductor packaging and testing, with makers stepping up efforts to expand advanced...
Wednesday 6 March 2024
Wafer foundry capacity expansion could pose risks
The worldwide IC design industry is stable, however, there is a notable increase in wafer foundry manufacturing capacity, which may provide potential risks, according to foundry sources.
Tuesday 5 March 2024
GenAI drives HBM memory demand
Generative AI has stimulated demand for High Bandwidth Memory (HBM), driving Taiwanese memory chipmakers to seize a share of the AI business opportunity.
Tuesday 5 March 2024
Chinese semiconductor market remains oversupplied
China's semiconductor market is being hit by a host of problems, such as overcapacity, with a bumpy ride likely lying ahead throughout 2024, according to industry sources.
Monday 4 March 2024
AI puts a rocket under HBM demand, SK Hynix rides the wave
The memory industry is set to exit the production cut phase as Generative AI superpowers high bandwidth memory (HBM) and DDR5 demand.
Friday 1 March 2024
TSMC ramping up CoWoS capacity
TSMC has been increasing its monthly production capacity for CoWoS (chip-on-wafer-on-substrate) advanced packaging, allowing it to increase AI GPU output for Nvidia and AMD, which...
Friday 23 February 2024
Intel confirms 3nm chip orders placed with TSMC
Intel CEO Pat Gelsinger has confirmed for the first time that two of the company's upcoming processors will be made using TSMC's 3nm processes.
Wednesday 21 February 2024
EIH to hire staff for capacity expansion
Taiwan-based E Ink Holdings (EIH), a provider of e-paper solutions, has launched a recruitment initiative to hire an additional 150 individuals for capacity expansion over the next...
Tuesday 20 February 2024
Intel rising: Intel squares up to TSMC, underestimates Samsung
Intel will hold its first Wafer Fabrication Services Conference (IFS Direct Connect 2024) in San Jose, California, on February 21.
2024 eXtended Reality Korea
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