Taiwan-based CWTC's board has approved several key resolutions, including the third-quarter 2024 profit distribution plan and a US$20 million cash capital increase for its Malaysian...
SK Hynix has strengthened its collaboration with TSMC, designating the foundry to manufacture its next-generation HBM4 logic die. The company's development of high-capacity Compute...
SK Hynix plans to reduce its legacy DRAM production to 20% by the fourth quarter of 2024, responding to increased supply and pricing pressure from Chinese memory manufacturers. The...
Vanguard International Semiconductor (VIS) reports that while price competition has diminished, market competition pressure persists due to continued mature process fabrication capacity...
Display driver IC (DDI) specialist Ilitek is poised to re-enter the capital market in late November as ITH Corporation. Ahead of ITH's upcoming listing on the stock market, chairman...
SK Hynix plans to provide samples of its 48GB, 16-layer HBM product—the industry's largest capacity and highest layer count—in the first quarter of 2025. CEO Noh-Jung...
OSAT ASE Technology (ASEH) has stepped up its pace of capacity expansion for advanced packaging to meet demand for AI device applications, which it anticipates to be a continual growth...
Intel CEO Pat Gelsinger will visit TSMC in Taiwan in November, according to industry sources, who also believe that recent media claims about TSMC withdrawing the Intel discount are...
Micro LED technology is emerging as a promising solution for high-speed AI data transmission and SiPh-based optical communication. Dr. David Su, Chief Strategy Officer of Ennostar,...
EMC, a leading manufacturer of environmentally friendly high-grade copper clad laminates (CCL), has announced its financial results for the third quarter of 2024. The company reported...
Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand for cloud AI accelerators,...
The third quarter financial results for both Samsung Electronics (Samsung) and Intel are set to be released on October 31, 2024. The outcome likely hinges on how well their management...
TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's subsidiary Siliconware Precision Industries (SPIL) has...
Samsung Electronics and Kioxia both plan to scale back their NAND flash production in the fourth quarter, according to sources within the industry supply chain. This suggests that...
TSMC, which acquired Innolux's 5.5G LCD fab in Tainan (southern Taiwan) in August, intends to acquire additional Innolux facilities that are adjacent to the one it has already acquired,...
