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Wednesday 3 September 2025
Why TSMC is holding back on advanced packaging despite soaring demand
TSMC's CoWoS capacity remains in high demand, securing its dominant position in advanced semiconductor packaging with rumored gross margins nearing 80%. However, TSMC is proceeding...
Tuesday 2 September 2025
Samsung and SK Hynix VEU exemption revocation opens door for Micron and Chinese chipmakers
On August 29, 2025, local time, the US Department of Commerce (DOC) announced it will revoke the Validated End-User (VEU) exemptions previously granted to South Korean manufacturers...
Tuesday 2 September 2025
Samsung reportedly restarts investment in Taylor fab; Tesla chip mass production timeline revealed
Samsung Electronics will resume its investment in the foundry plant in Taylor, Texas. The previous delays caused by customer confirmation issues have reportedly been resolved, and...
Tuesday 2 September 2025
Saudi Arabia targets third place in global AI race with massive data center investments
Saudi Arabia aims to become a leading global AI supplier, positioning computing power as its new economic focus. The kingdom targets reaching the world's third-largest AI supplier...
Tuesday 2 September 2025
OpenAI's rumored India Stargate plan could unlock huge growth for Nvidia and global AI server suppliers
OpenAI is exploring plans for a massive data center in India that would rank among the country's largest facilities, according to Bloomberg. The proposed site would feature...
Monday 1 September 2025
SMIC tightens grip on Beijing unit in latest wave of China wafer fab mergers
China's SMIC said it will acquire the remaining 49% stake in its subsidiary, SMIC North Integrated Circuit Manufacturing (Beijing), also known as SMIC North, through an issuance of...
Monday 1 September 2025
APCB faces pressure after capacity reduction, eyes boost from DDR5, optical modules in 2026
Taiwan-based PCB manufacturer APCB is launching two new products in 2025, following significant capacity downsizing in 2024. However, the company noted that the new QSFP optical module...
Monday 1 September 2025
South Korea’s HBM pioneer highlights hybrid bonding and compute-in-memory trends
As artificial intelligence and high-performance computing continue to advance rapidly, high-bandwidth memory (HBM) paired with GPUs has become a critical battleground in the semiconductor...
Sunday 31 August 2025
Intel veteran to head ADI’s Oregon fab as leadership exodus deepens

Narahari Ramanuja, a 25-year Intel veteran and former director of advanced packaging technology development, is leaving the company to...

Friday 29 August 2025
China reportedly plans to triple AI chip output by 2026, with 3 fabs for Huawei
China is preparing to triple its domestic AI chip production by 2026, according to people cited by the Financial Times. Three new wafer fabs...
Friday 29 August 2025
Samsung reportedly explores BOE's WOLED panels for its gaming monitors

BOE Technology is reportedly in talks with Samsung Electronics and other manufacturers to supply white OLED (WOLED) panels for monitors,...

Friday 29 August 2025
Nvidia and Google cash in on AI inference as AMD racks up losses
Global technology giants are racing to expand AI inference capacity, and Morgan Stanley says the economics are proving extraordinary. A new report from the bank, based on detailed...
Friday 29 August 2025
Analysis: Why Taiwan sees more promise in four legs than in humanoid hype for robots
Humanoid robots remain far from commercial readiness, with ongoing doubts about their practicality and technical feasibility. As debate continues over when — or even if —...
Thursday 28 August 2025
Nvidia ramps GB300, RTX PRO, and Rubin platforms as AI infrastructure demand soars
Nvidia posted US$46.7 billion in revenue for the second quarter, up 56% year-on-year, driven by strong AI and data center demand. Looking ahead, the company is ramping GB300 racks,...
Wednesday 27 August 2025
Nvidia's CoWoP PCB architecture targets ABF substrates but faces warpage risk
Nvidia's new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification...