Ichia Technologies, a provider of mechanism integration components and flexible PCBs (FPCB), anticipates that automotive product sales will account for more than 70% of its total...
A multi-year supply deal for silicon carbide (SiC) and silicon (Si) power semiconductors has been struck by Infineon Technologies, Hyundai Motor Company, and Kia. Infineon will build...
LCD panel component suppliers are aware of the volatility of demand in the fourth quarter of 2023, although overall operations in the second half of this year are expected to beat...
As Samsung Electronics and other chipmakers substantially reduce their NAND flash wafer output, industry sources indicate that memory module manufacturers will have to compete on...
MicroLED chip specialist PlayNitride is investigating obtaining strategic investment from downstream partners in order to raise funds for capacity development, according to the Taiwan-based...
Denso and Mitsubishi Electric have agreed to invest an aggregate US$1 billion in Coherent's silicon carbide (SiC) business. The transaction results from the strategic review process...
Despite better-than-anticipated third-quarter revenues, TSMC is expected to reiterate its previously stated revenue and capex projections for 2023 at its upcoming investors conference,...
With Micro LED applications diversifying their development, PlayNitride chairman Charles Li stated that not only do they have two to three new mass-production orders right now, but...
Major semiconductor makers are increasing available capacity for DDR5 memory, which is set to become mainstream in 2024, according to sources at memory module houses.
Passive component maker Yageo is scheduled to enter volume production at the phase three facility of its factory site in the Dafa Industrial Park (Kaohsiung, Southern Taiwan) in the...
Despite recent price increases for memory chips, major suppliers including Samsung Electronics, SK Hynix, Micron Technology, and Kioxia may still struggle to return to profitability...
Applied Materials and its equipment and materials partners have entered the supply chain for Intel's recently announced glass substrates for advanced packaging, according to industry...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
As offshore wind power advances into phase 3.1, coastal wind farm sites are gradually reaching saturation, underscoring the growing importance of precise site selection. Industry...
