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Thursday 21 September 2023
Shallow-water wind farms nearing full capacity, what lies ahead for site selection?
As offshore wind power advances into phase 3.1, coastal wind farm sites are gradually reaching saturation, underscoring the growing importance of precise site selection. Industry...
Wednesday 20 September 2023
Samsung's NAND plant in China faces process upgrade dilemma; shifting capacity to power semiconductors could be viable solution
As the US-China conflict continues to intensify, Samsung Electronics' NAND Flash plant in Xi'an, China, is increasingly stuck in a process upgrade dilemma. On the one hand, with the...
Wednesday 20 September 2023
Global 200mm fabs to reach record high capacity by 2026, says SEMI
Semiconductor manufacturers worldwide are projected to increase 200mm fab capacity by 14% from 2023 through 2026, adding 12 new 200mm fabs as the industry reaches a record high of...
Thursday 14 September 2023
Global fab equipment spending to return to growth in 2024
In 2023, global spending on fab equipment for front-end facilities is projected to decrease by 15% before rebounding with a 15% year-over-year increase in 2024, according to a recent...
Wednesday 13 September 2023
India iPhone 15 production capacity still lags behind China
China and India have both contributed to the initial production volumes of the iPhone 15 series but the share from China is still larger than that from India with the latter still...
Monday 11 September 2023
Eaton set to expand capacity for power management solutions in Taiwan
Given the global trend towards net-zero emissions and the ongoing implementation of carbon tax mechanisms, how to more effectively utilize power has become one of the most critical...
Friday 8 September 2023
Infineon gearing up for automotive chip boom
Infineon Technologies is expanding its production capacity to meet the rising demand for semiconductors used in electric vehicles (EV) and other automotive applications over the next...
Thursday 7 September 2023
TSMC expanding CoWoS packaging capacity
The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.
Wednesday 6 September 2023
PlayNitride sees new challenges facing microLED tech development
As the applications for microLED expand, it is being challenged by the relationship between cost, production capacity, and market demand that new technologies face when entering the...
Tuesday 29 August 2023
TSEC lands big PV module orders in Taiwan
Solar cell and PV module maker TSEC on August 28 announced to have obtained NT$3 billion (US$93.3 million) worth of orders for PV modules that will be established on fish farms in...
Tuesday 22 August 2023
Advanced packaging capacity to surge 30–40% in 2024, says TrendForce
With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...
Monday 21 August 2023
Alchip raises revenue outlook for 2023
Taiwan-based Alchip Technologies, dedicated to supplying ASICs, has raised its revenue forecast for 2023 from US$800 million to between US$900 million and US$950 million.
Friday 18 August 2023
Advanced packaging becomes next battlefield for Intel and TSMC
The importance of advanced packaging to the continuation of Moore's Law has already attracted TSMC and Intel to the field.
Wednesday 16 August 2023
PCB maker Dynamic expects flat or slight revenue growth in 2H23
PCB manufacturer Dynamic Electronics expects to post flat or slight revenue growth in the second half of this year compared to the first, with a higher gross margin thanks to improved...
Tuesday 15 August 2023
Intel now in global advanced-node capacity race with TSMC
Recently, Intel and TSMC have both solidified their latest process technology advancements and future global production plans. In 2024, Intel officially initiated its internal reorganization...