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Monday 7 August 2023
Winbond slowing output cut, to equip new plant in 4Q23
The 30–40% reduction in output at Winbond Electronics' wafer fab in Taichung (central Taiwan) has been reduced to less than 20%, and the memory chipmaker plans to begin installing...
Friday 4 August 2023
AMD's Lisa Su: AI production capacity has received sufficient assurance
AMD CEO Lisa Su's Asia tour in July to secure its supply chain became the focal point for analysts during the company's 2Q23 financial earnings call. In particular, discussions on...
Friday 4 August 2023
Infineon to build 200mm SiC fab in Malaysia
The trend toward decarbonization will lead to robust market growth for power semiconductors, particularly those based on materials with wide bandgaps. According to Infineon Technologies,...
Thursday 3 August 2023
China foundries enhancing mature node manufacturing capability for automotive chips
Chinese foundries including CanSemi Technology, GTA Semiconductor, and Nexchip Semiconductor have stepped up enhancing their mature-node manufacturing capability for automotive ICs,...
Wednesday 2 August 2023
China dominates e-paper module production as demand grows
China has become the primary production base for e-paper modules, accounting for over 90% of the global shipments. As the demand for electronic paper rises, firms in China are positioning...
Tuesday 1 August 2023
VIS posts sequential profit growth in 2Q23
Specialty IC foundry Vanguard International Semiconductor (VIS) has reported net profits surged 46.3% sequentially to nearly NT$2 billion (US$63.2 million) in the second quarter of...
Monday 31 July 2023
TSMC reportedly invited to set up CoWoS packaging capacity in US, Japan
In light of the severe shortage of CoWoS (chip-on-wafer-on-substrate) packaging capacity for AI GPUs now in hot demand, the US and Japan reportedly are aggressively re-inviting TSMC...
Friday 28 July 2023
Micron announces highest capacity HBM with collaboration efforts from TSMC
Micron Technology has announced that it has begun sampling what it calls the industry's first 8-high 24GB HBM3 Gen2 memory with bandwidth greater than 1.2TB/s and pin speed over 9.2Gb/s,...
Thursday 27 July 2023
Innolux expects 7–9% increase in large-size panel ASP in 3Q23
Innolux expects large-size panel ASP to pick up 7–9% from before in the third quarter with LCD TV panel prices continuing to stabilize and increasing procurement of IT panels,...
Wednesday 26 July 2023
Samsung and SK Hynix to expand packaging capacity for HBM
High bandwidth memory (HBM) has become a hot keyword in the memory industry recently. As the demand for HBM is increasing due to the AI and HPC market expansion, HBM is likely to...
Friday 21 July 2023
Radiant, GLT ramping up capacity in Vietnam
Taiwan-based LED backlight module supplier Radiant Opto-Electronics and light guide plate maker Global Lighting Technologies (GLT) are building new production capacities in Vietnam...
Thursday 20 July 2023
Samsung reportedly eyes Nvidia orders as TSMC packaging capacity remains tight
As GPUs become essential components for artificial intelligence (AI) computing, orders for Nvidia GPUs are also garnering attention. Recently, there have been reports that Nvidia...
Thursday 20 July 2023
DDR5 memory prices rise slightly
DDR5 memory has recently shown a modest increase, indicating that the market price is about to enter the stage of recovering from its lowest point, according to industry sources.
Monday 17 July 2023
BYD ups SiC epitaxy capacity by 50% in 2023
BYD is set to expand its silicon carbide (SiC) epitaxy capacity by 50% in 2023 and has already begun installing equipment with the production lines to be fully completed by September...
Monday 17 July 2023
On-Premise datacenter capacity being increasingly dwarfed by hyperscalers and colocation companies, says Synergy Research
As the number of large datacenters operated by hyperscale providers approaches 900, new data from Synergy Research Group shows that they now account for 37% of the worldwide capacity...