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Friday 23 January 2026
SAS charts new profit trajectory with GaN surge and semiconductor service chain value enhancement
Under the leadership of Sino-American Silicon Products Group (SAS) chairwoman Doris Hsu, 2026 was set to be a pivotal year for the group's compound semiconductor business unit, which...
Friday 23 January 2026
ASML leads chip equipment charge into advanced packaging
Global semiconductor equipment suppliers are accelerating their push into advanced packaging. They are positioning back-end processes as a new growth engine as artificial intelligence...
Friday 23 January 2026
Analysis: How Howard Lutnick is redrawing the memory-chip map

US Commerce Secretary Howard Lutnick is driving a fundamental reordering of the global semiconductor supply chain. According to exclusive...

Friday 23 January 2026
TSMC and Samsung reduce 8-inch wafer capacity, but oversupply still remains
TSMC chairman C.C. Wei confirmed adjustments in 8-inch and mature process capacities to improve efficiency, with Samsung also cutting 8-inch output. Despite these reductions and price...
Friday 23 January 2026
TSMC reveals dual purpose behind Chiayi AP7 plant as Yunlin expansion looms
TSMC has significantly expanded its advanced packaging capacity in recent years to meet surging AI customer demand. Despite planning six to eight phases for the Chiayi site, internal...
Friday 23 January 2026
South Korea-made EUV pellicles to be adopted at Samsung's Taylor fab
Industry sources stated that Samsung has signed equipment contracts and placed orders for extreme ultraviolet (EUV) photomask pellicle-related equipment for its Taylor fab with South...
Friday 23 January 2026
RDIMM spot prices blow past US$2,000, raising odds of 80% Samsung memory hike
Structural imbalances in the memory industry have emerged due to AI data center demand, sending server memory prices sky high and upstream manufacturers to go all out to increase profits...
Friday 23 January 2026
Intel’s “better than guidance” quarter comes with a catch
Intel's latest financials highlight a fragile turnaround: while AI-linked data center demand and early traction in advanced manufacturing offer strategic promise, weak margins, volatile...
Friday 23 January 2026
Lip-Bu Tan faces Intel's first real bottleneck of the AI era
Intel outlined an increasingly AI-centric roadmap across client PCs, data centers, and manufacturing. Still, executives cautioned that tight supply and early-stage foundry ramps continue...
Friday 23 January 2026
Intel slows its most ambitious node—and signals where the real battle is for now
Intel is sharpening its manufacturing strategy around yield improvement, selective capital spending, and differentiated advanced packaging, while keeping major 14A capacity investments...
Friday 23 January 2026
HBF likely overtaking HBM market by 2038 as commercialization speeds up

High-Bandwidth Flash (HBF) is likely to reach commercialization sooner than previously expected and could become a key technology supporting...

Friday 23 January 2026
Fiberglass crunch spurs supply scramble as CCL makers ban order changes

As AI chip package sizes continue to grow, warpage issues in IC substrates have become more pronounced. Capacity constraints for low-CTE...

Friday 23 January 2026
NAND shortages help Phison to enter US server supply chain
Severe NAND flash shortages driven by AI servers have emerged, but have become a growth opportunity for Phison Electronics. Company CEO K.S. Pua said that the shortage is enabling...
Thursday 22 January 2026
SAS shifts SiC strategy with 12-inch wafers and AI glasses innovation
Facing intense price wars triggered by China's rapid expansion in the global silicon carbide (SiC) wafer industry, Sino-American Silicon Products (SAS) chairwoman Doris Hsu has decisively...
Thursday 22 January 2026
Nvidia overtakes Apple as TSMC's largest customer

Nvidia CEO Jensen Huang said rising demand for AI computing has pushed the company past Apple to become the largest customer of Taiwan...