TSMC-reinvested backend house Xintec will see little seasonality impact on its revenues for the first half of 2020 as robust packaging demand for DOE (diffractive optical element)...

Taiwan-based makers of CMOS image sensor (CIS) and VCSEL components are optimistic that multi-lens camera modules incorporating ToF (time of flight) sensing technology will be mass-adopted...

At the ongoing CES, SK Hynix has unveiled its PCIe NVMe consumer SSD series. The drives are built with SK Hynix' 128-layer 4D NAND flash, just six months after the company announced...

Taiwan-based testing house King Yuan Electronics (KYEC) is expected to see its first-quarter 2020 revenues hit the highest record ever for the same quarter with monthly revenues to...

A heavyweight CMOS image sensor (CIS) packaging firm will be born in Taiwan soon, as Tong Hsing Electronic Industries, a handset CIS backend and wafer reconstruction specialist, has...

Taiwan's CMOS image sensor (CIS) packaging specialists including Kingpak Technology, Xintec,VisEra Technologies and Tong Hsing Electronic Industries are expected to benefit significantly...

TSMC has obtained orders for CMOS image sensors from Sony, and will fabricate the chips using 40nm process technology at Fab 14A in Tainan, southern Taiwan, according to a recent...

CMOS image sensor (CIS) packaging specialist Kingpak Technology has reported consolidated revenues of NT$205 million (US$6.8 million) for October 2019, surging 30% sequentially and...

Sony and Samsung Electronics have been competing head to head in the CMOS image sensor (CIS) market in order to maintain their leadership, using their respective technology advantages,...

CMOS image sensor suppliers Sony and OmniVision have both enjoyed robust demand for multi-camera smartphones from Huawei, with their regional distributors and backend suppliers being...

CMOS image sensor (CIS) packaging specialist Xintec has put increased focus on high-profit segments of healthcare, industrial control and automotive CIS applications, and expects...

Tong Hsing Electronic Industries, which provides ceramic substrates and niche-IC backend services, has elected its new board of directors with Yageo chairman Pierre Chen becoming...

Himax Technologies has introduced its ultra-low power, AI-based visual sensor for notebooks, with the solution already certified by Quanta Computer.

Taiwan's CMOS image sensor (CIS) packaging specialist Kingpak Technology is expected to see its second-quarter revenues fall only slightly on quarter as its average capacity utilization...

GEM Services, which specializes in packaging semiconductor power devices, and CMOS image sensor backend specialist Kingpak Technology both saw their revenues for the first quarter...

King Yuan Electronics (KYEC), Kingpak Technology and GEM Services are expected to see their sales growth exceed the seasonal average in the first half of 2019, outperforming their...

CMOS image sensor (CIS) backend service provider Kingpak Technology is expected to enjoy revenue growth of 10-15% in 2019 with higher profits than year-ago levels, according to market...

Shipments of Android-based smartphones featuring 3D sensing technology are set to boom in 2019, propelled by the increasing adoption of back-end time-of-flight (ToF) sensor solutions,...

Taiwan-based foundries including Vanguard International Semiconductor (VIS), Episil Technologies and Mosel Vitelic will continue to enjoy brisk demand for power discrete semiconductors...

CMOS image sensor (CIS) backend service provider Kingpak Technology is on track to complete building new production capacity for automotive applications by mid 2019, according to...

CMOS image sensor (CIS) backend service firm Kingpak Technology has seen its order visibility extend to the first half of 2019, and will see its capacity utilization rate rebound...

CMOS image sensor (CIS) backend service firm Kingpak Technology saw disappointing October revenues, as clients' requests to defer some of their shipments reduced its production capacity...

CMOS image sensor demand (CIS) is set to boom for application to triple-lens camera phones and automotive electronics in 2019, prompting leading CIS maker Sony to expand capacity...

Image sensor packaging specialist Xintec saw its net losses widen to NT$5.81 (US$0.19) per share in the first half of 2018 from NT$2.25 a year earlier.

Taiwan-based CMOS image sensor (CIS) suppliers including related backend service providers have put increased focus on niche-market applications such as automotive and medical, as...