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NEWS TAGGED DIGITIMES ASIA
Monday 6 July 2026
Weekly news roundup: Anthropic tightens controls; Innoscience-Infineon clash shows the weaponization of China's courts
Below are the most-read DIGITIMES stories from the week of June 29-July 5, 2026:
Tuesday 30 June 2026
SK Hynix accelerates Yongin fab timeline by 12 years as HBM strains memory capacity
SK Hynix said on June 29 it will spend KRW1,100 trillion (approx. US$710 billion) across three sites in South Korea over the coming decades, accelerating its Yongin cluster...
Monday 29 June 2026
Weekly news roundup: South Korea takes physical AI push from policy to practice; Europe aggressively pursues non-red supply chains
Below are the most-read DIGITIMES Asia stories from the week of June 22-28, 2026:
Friday 26 June 2026
Inside Corning: a century of R&D bets, and why optical fiber is paying off again
Preface
Monday 22 June 2026
Weekly news roundup: Micron CEO turns visa rejection into US$1 trillion milestone; Taiwan LED makers look beyond lighting
Below are the most-read DIGITIMES Asia stories from the week of June 15-21, 2026:
Monday 15 June 2026
Weekly news roundup: Samsung foundry profit rebound may come in 3Q26; Nvidia unveils AI PC vision
Below are the most-read DIGITIMES Asia stories from the week of June 8-14, 2026:
Monday 8 June 2026
Weekly news roundup: Taiwan ecosystem strengthens AI chip supply chain as MediaTek, Nvidia deepen cooperation
Below are the most-read DIGITIMES Asia stories from the week of June 1-7, 2026:
Monday 1 June 2026
Weekly news roundup: Nvidia CEO hosts trillion-dollar dinner; TSMC CEO to address bonus backlash in person
Below are the most-read DIGITIMES Asia stories from the week of May 25-31, 2026:
Monday 25 May 2026
Weekly news roundup: TSMC faces its first real rivals; Agibot claims 100% success rate in factory deployment
Below are the most-read DIGITIMES Asia stories from the week of May 18-24, 2026:
Monday 18 May 2026
Weekly news roundup: TSMC faces AI supply strain as Samsung, Intel, and Apple test foundry alternatives
Below are the most-read DIGITIMES Asia stories from the week of May 11-17, 2026:
Monday 11 May 2026
Weekly news roundup: Taiwan freezes trading in MediaTek; 2D NAND shortage spirals
Below are the most-read DIGITIMES Asia stories from the week of May 4-10, 2026:
Monday 4 May 2026
Weekly News Roundup: Terafab already affecting wafer fab landscape; Intel launches multi-year reset
Below are the most-read DIGITIMES Asia stories from the week of April 27-May 4, 2026:
Monday 27 April 2026
Weekly news roundup: Micron's Sanand ramp shifts India chip debate; Qualcomm Chief reportedly seeks deals in South Korea
Below are the most-read DIGITIMES Asia stories from the week of April 20-27, 2026:
Monday 20 April 2026
Weekly news roundup: Samsung launches voluntary retirement; Qualcomm moves into custom DRAM with CXMT
Below are the most-read DIGITIMES Asia stories from the week of April 13-19, 2026:
Monday 13 April 2026
Weekly news roundup: Shortages spread to MLCCs; SK Hynix reportedly in talks with Microsoft and Google
Below are the most-read DIGITIMES Asia stories from the week of April 6-April 13, 2026:
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BIZ FOCUS
Sep 2, 08:22
World Diamond Technology accelerates mass production of 300 mm diamond wafers
Wednesday 2 September 2026
Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
Wednesday 2 September 2026
Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
Wednesday 2 September 2026
8 September Hsinchu seminar: Silicon photonics driving AI chains
MOST-READ
7 DAYS NEWS
Exclusive: Musk pushes US solar supply chain upstream as polysilicon ambitions emerge
Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
Interview: Nvidia exec on progress of CPO production and pluggable optics
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Kioxia pitches flash as a DRAM substitute as Micron, YMTC close in
Micron reportedly targets 2× HBM capacity by end-2026; Samsung, SK Hynix keep the scale edge
Nvidia's Hugging Face terms pay out its chip rivals and reserve US$1 billion to keep the staff
Silicon photonics testing shift could reshape how CPO suppliers win business
China interconnect chipmaker Montage enters Samsung, SK Hynix CXL 3.2 supply chains and begins DDR6 development
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