The global advanced IC substrate market is poised for significant growth, according to recent industry reports. Global Information, Inc. (GII) projects the market to reach US$18.11...

Japan-based Toppan announced a plan to build a plant in Singapore for producing FC-BGA substrates used in chip packaging, with operations expected to begin by the end of 2026. If...

To capitalize on the demand for generative AI, Toppan Holdings (formerly Toppan Printing) reportedly plans to invest approximately JPY60 billion (US$403 million) to expand the production...