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NEWS TAGGED FLASH
Wednesday 15 September 2021
Kioxia debuts PCIe 4.0 storage class memory SSDs
Kioxia has announced it is sampling its FL6 Series enterprise NVMe SCM SSDs. Featuring Kioxia's SCM solution, XL-FLASH, the dual-port and PCIe 4.0-compliant FL6 Series SSDs bridge...
Tuesday 14 September 2021
Industrial memory demand slowing down
Industrial memory demand picked up in the second quarter, but has started slowing down during the latter half of the third quarter due to seasonal factors, according to industry so...
Monday 13 September 2021
Chipmakers gearing up for QLC NAND chip output ramp-up
Major NAND flash chip suppliers are poised to ramp up their output for QLC (quad-level cell) NAND chips between the end of this year and 2022, eyeing robust demand for not only PCs...
Monday 13 September 2021
China Big Fund stepping up investment in homegrown memory sector
More China-based memory makers will receive cash injections from the government, as China's National IC Industry Investment Fund (Big Fund) steps up its investment in the country's...
Wednesday 8 September 2021
Adata expects DRAM spot prices to be stable in 4Q21
Memory module maker Adata Technology expects price stability to take place in the DRAM spot market starting the fourth quarter of 2021.
Monday 30 August 2021
NAND flash controller prices to rise in 4Q21
NAND flash device controller chip prices are under increasingly upward pressure, as foundries are set to initiate further price hikes for mature process technologies later this year...
Thursday 26 August 2021
Global NAND flash output value increases 10.8% in 2Q21, says TrendForce
The global NAND flash industry generated US$16.4 billion in output value in the second quarter of 2021, up 10.8% sequentially, according to TrendForce.
Tuesday 24 August 2021
YMTC sees low yield rates for 128-layer 3D NAND flash
China's Yangtze Memory Technologies (YMTC) continues to suffer from low yield rates for 128-layer 3D NAND flash manufacturing, which are estimated at only 30-40%, according to market...
Monday 23 August 2021
NAND flash market to regain balance in 2022, says Silicon Motion president
The global NAND flash memory market is expected to reach the balance of supply and demand in 2022, when the overall bit supply growth is expected to stay at about 30%, according to...
Monday 23 August 2021
Macronix ArmorFlash NOR Flash Earns PSA Certified Level 1 status at device level
Macronix International, a leading integrated device manufacturer in the non-volatile memory (NVM) market, has announced its ArmorFlash MX75 series NOR Flash received PSA Certified...
Wednesday 18 August 2021
Phison striving to secure supply commitments from NAND chip vendors
Phison Electronics is striving to strike deals with NAND flash chip providers for 2022 and finds it difficult to secure supply commitments from the memory chip vendors, according...
Wednesday 18 August 2021
Macronix to enhance 3D NAND, advanced NOR flash offerings
Macronix International will be strengthening its 3D NAND and advanced NOR flash offerings, eyeing a bigger presence in the automotive and other niche-market sectors, according to...
Thursday 12 August 2021
Kioxia sampling new UFS 3.1 embedded flash memory devices
Kioxia America has announced the sampling of its newest generation of 256GB and 512GB Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices.
Wednesday 11 August 2021
ChipMOS sees lucrative memory backend prospect for 2H21
Display driver IC and memory backend specialist ChipMOS Technologies is guardedly optimistic about its business prospects for the third quarter of 2021, with backend services for...
Monday 9 August 2021
Phison expects output to jump in 2022
Phison Electronics has managed to obtain more capacity support from two foundry service providers, and will see its output for 2022 jump 200% from this year, according to KS Pua,...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.