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NEWS TAGGED GOLD
Wednesday 12 February 2014
SPIL to grow sales of silver wire-bonding packaging in 2014
Chip packager Siliconware Precision Industries (SPIL) expects the development of its silver wire-bonding packaging business to bear fruit in 2014.
Wednesday 7 September 2011
Proportion of copper wire bonding to rise to over 20% in 2011, says SEMI
Due to rising gold prices, replacement of conventional processes based on gold wire with copper-wire bonding processes is increasing. The proportion of total wire bonding volume for...